Pull devicetree updates from Rob Herring:
"DT core:
- Add node lifecycle unit tests
- Add of_property_present() helper aligned with fwnode API
- Print more information on reserved regions on boot
- Update dtc to upstream v1.6.1-66-gabbd523bae6e
- Use strscpy() to instead of strncpy() in DT core
- Add option for schema validation on %.dtb targets
Bindings:
- Add/fix support for listing multiple patterns in DT_SCHEMA_FILES
- Rework external memory controller/bus bindings to properly support
controller specific child node properties
- Convert loongson,ls1x-intc, fcs,fusb302, sil,sii8620, Rockchip
RK3399 PCIe, Synquacer I2C, and Synquacer EXIU bindings to DT
schema format
- Add RiscV SBI PMU event mapping binding
- Add missing contraints on Arm SCMI child node allowed properties
- Add a bunch of missing Socionext UniPhier glue block bindings and
example fixes
- Various fixes for duplicate or conflicting type definitions on DT
properties"
* tag 'devicetree-for-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (66 commits)
dt-bindings: regulator: Add mps,mpq7932 power-management IC
of: dynamic: Fix spelling mistake "kojbect" -> "kobject"
dt-bindings: drop Sagar Kadam from SiFive binding maintainership
dt-bindings: sram: qcom,imem: document sm8450
dt-bindings: interrupt-controller: convert loongson,ls1x-intc.txt to json-schema
dt-bindings: arm: Add Cortex-A715 and X3
of: dynamic: add lifecycle docbook info to node creation functions
of: add consistency check to of_node_release()
of: do not use "%pOF" printk format on node with refcount of zero
of: unittest: add node lifecycle tests
of: update kconfig unittest help
of: add processing of EXPECT_NOT to of_unittest_expect
of: prepare to add processing of EXPECT_NOT to of_unittest_expect
of: Use preferred of_property_read_* functions
of: Use of_property_present() helper
of: Add of_property_present() helper
of: reserved_mem: Use proper binary prefix
dt-bindings: Fix multi pattern support in DT_SCHEMA_FILES
of: reserved-mem: print out reserved-mem details during boot
dt-bindings: serial: restrict possible child node names
...
The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the
Qualcomm PMIC Thermal Monitoring ADC. Based on downstream sources, the
new compatible for TM7 differs from older TM5 by allowing configuring
per sensor decimation, time measurement and number of sample averaging -
unlike one configuration per entire device. This was not reflected in
the bindings, therefore comment the new compatible as incomplete as it
might change and its ABI is no stable.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230113090107.18498-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Pull more thermal control updates from Rafael Wysocki:
"These are updates of assorted thermal drivers, mostly for ARM
platforms, generally isolated and fairly straightforward, and the
recent Intel HFI driver fix for systems without HFI support.
Specifics:
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada)
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido
Schimmel)
- Add support for IPQ8074 in the tsens thermal driver along with the
DT bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add HWMon support for the imx8mm board (Alexander Stein)
- Remove pointless include from the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug in the tsens
QCom driver (Manivannan Sadhasivam)
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof)
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn
Andersson)
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König)"
* tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits)
thermal/drivers/imx_sc_thermal: Drop empty platform remove function
thermal/drivers/qcom/lmh: Fix irq handler return value
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
dt-bindings: thermal: k3-j72xx: elaborate on binding description
thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
thermal/drivers/qcom: Demote error log of thermal zone register to debug
thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
thermal/core/power allocator: Remove a useless include
thermal/drivers/imx8mm: Add hwmon support
thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
thermal/drivers/imx: Add support for loading calibration data from OCOTP
...
Only some of TI's J721E SoCs will need a eFuse register range mapped to
determine if they're affected by TI's i2128 erratum. All other SoC will
not need this eFuse range to function properly
Update the bindings for the k3_j72xx_bandgap thermal driver so other
devices will only need two register ranges
Signed-off-by: Bryan Brattlof <bb@ti.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-7-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Document compatible string 'mediatek,mt7986-thermal' for V3 thermal
unit found in MT7986 SoCs.
'mediatek,mt7981-thermal' is also added as it is identical with the
thermal unit of MT7986.
Signed-off-by: Daniel Golle <daniel@makrotopia.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with
calibration values from OCOTP. Document optional phandle to OCOTP nvmem
provider.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Marek Vasut <marex@denx.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Convert the 'generic-adc-thermal' binding to DT schema format.
The binding said '#thermal-sensor-cells' should be 1, but all in tree
users are 0 and 1 doesn't make sense for a single channel.
Drop the example's related providers and consumers of the
'generic-adc-thermal' node as the convention is to not have those in
the examples.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221011175235.3191509-1-robh@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Pull devicetree updates from Rob Herring:
"DT Bindings:
- Various LED binding conversions and clean-ups. Convert the
ir-spi-led, pwm-ir-tx, and gpio-ir-tx LED bindings to schemas.
Consistently reference LED common.yaml or multi-led schemas and
disallow undefined properties.
- Convert IDT 89HPESx, pwm-clock, st,stmipid02, Xilinx PCIe hosts,
and fsl,imx-fb bindings to schema
- Add ata-generic, Broadcom u-boot environment, and dynamic MTD
sub-partitions bindings.
- Make all SPI based displays reference spi-peripheral-props.yaml
- Fix some schema property regex's which should be fixed strings or
were missing start/end anchors
- Remove 'status' in examples, again...
DT Core:
- Fix a possible NULL dereference in overlay functions
- Fix kexec reading 32-bit "linux,initrd-{start,end}" values (which
never worked)
- Add of_address_count() helper to count number of 'reg' entries
- Support .dtso extension for DT overlay source files. Rename staging
and unittest overlay files.
- Update dtc to upstream v1.6.1-63-g55778a03df61"
* tag 'devicetree-for-6.2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (42 commits)
dt-bindings: leds: Add missing references to common LED schema
dt-bindings: leds: intel,lgm: Add missing 'led-gpios' property
of: overlay: fix null pointer dereferencing in find_dup_cset_node_entry() and find_dup_cset_prop()
dt-bindings: lcdif: Fix constraints for imx8mp
media: dt-bindings: atmel,isc: Drop unneeded unevaluatedProperties
dt-bindings: Drop Jee Heng Sia
dt-bindings: thermal: cooling-devices: Add missing cache related properties
dt-bindings: leds: irled: ir-spi-led: convert to DT schema
dt-bindings: leds: irled: pwm-ir-tx: convert to DT schema
dt-bindings: leds: irled: gpio-ir-tx: convert to DT schema
dt-bindings: leds: mt6360: rework to match multi-led
dt-bindings: leds: lp55xx: rework to match multi-led
dt-bindings: leds: lp55xx: switch to preferred 'gpios' suffix
dt-bindings: leds: lp55xx: allow label
dt-bindings: leds: use unevaluatedProperties for common.yaml
dt-bindings: thermal: tsens: Add SM6115 compatible
of/kexec: Fix reading 32-bit "linux,initrd-{start,end}" values
dt-bindings: display: Convert fsl,imx-fb.txt to dt-schema
dt-bindings: Add missing start and/or end of line regex anchors
dt-bindings: qcom,pdc: Add missing compatibles
...
The reference by path (&{/cpus/cpu@101/thermal-idle}) in the example causes
an error with new version of dtc:
FATAL ERROR: Can't generate fixup for reference to path &{/cpus/cpu@100/thermal-idle}
This is because the examples are built as an overlay and absolute paths
are not valid as references must be by label. The path was also not
resolvable because, by default, examples are placed under 'example-N'
nodes.
As the example contains top-level nodes, the root node must be explicit for
the example to be extracted as-is. This changes the indentation for the
whole example, but the existing indentation is a mess of of random amounts.
Clean this up to be 4 spaces everywhere.
Link: https://lore.kernel.org/r/20221111162729.3381835-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
As per the new ADC7 architecture used by the Qualcomm PMICs, each PMIC
has the static Slave ID (SID) assigned by default. The primary PMIC
PMK8350 is responsible for collecting the temperature/voltage data from
the slave PMICs and exposing them via it's registers.
For getting the measurements from the slave PMICs, PMK8350 uses the
channel ID encoded with the SID of the relevant PMIC. So far, the
dt-binding for the slave PMIC PM8350 assumed that there will be only
one PM8350 in a system. So it harcoded SID 1 with channel IDs.
But this got changed in platforms such as Lenovo X13s where there are a
couple of PM8350 PMICs available. So to address multiple PM8350s, change
the binding to accept the SID specified by the user and use it for
encoding the channel ID.
It should be noted that, even though the SID is static it is not
globally unique. Only the primary PMIC has the unique SID id 0.
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20221103095810.64606-2-manivannan.sadhasivam@linaro.org
Pull devicetree updates from Rob Herring:
"DT core:
- Fix node refcounting in of_find_last_cache_level()
- Constify device_node in of_device_compatible_match()
- Fix 'dma-ranges' handling in bus controller nodes
- Fix handling of initrd start > end
- Improve error reporting in of_irq_init()
- Taint kernel on DT unittest running
- Use strscpy instead of strlcpy
- Add a build target, dt_compatible_check, to check for compatible
strings used in kernel sources against compatible strings in DT
schemas.
- Handle DT_SCHEMA_FILES changes when rebuilding
DT bindings:
- LED bindings for MT6370 PMIC
- Convert Mediatek mtk-gce mailbox, MIPS CPU interrupt controller,
mt7621 I2C, virtio,pci-iommu, nxp,tda998x, QCom fastrpc, qcom,pdc,
and arm,versatile-sysreg to DT schema format
- Add nvmem cells to u-boot,env schema
- Add more LED_COLOR_ID definitions
- Require 'opp-table' uses to be a node
- Various schema fixes to match QEMU 'virt' DT usage
- Tree wide dropping of redundant 'Device Tree Binding' in schema
titles
- More (unevaluated|additional)Properties fixes in schema child nodes
- Drop various redundant minItems equal to maxItems"
* tag 'devicetree-for-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (62 commits)
of: base: Shift refcount decrement in of_find_last_cache_level()
dt-bindings: leds: Add MediaTek MT6370 flashlight
dt-bindings: leds: mt6370: Add MediaTek MT6370 current sink type LED indicator
dt-bindings: mailbox: Convert mtk-gce to DT schema
of: base: make of_device_compatible_match() accept const device node
of: Fix "dma-ranges" handling for bus controllers
of: fdt: Remove unused struct fdt_scan_status
dt-bindings: display: st,stm32-dsi: Handle data-lanes in DSI port node
dt-bindings: timer: Add power-domains for TI timer-dm on K3
dt: Add a check for undocumented compatible strings in kernel
kbuild: take into account DT_SCHEMA_FILES changes while checking dtbs
dt-bindings: interrupt-controller: migrate MIPS CPU interrupt controller text bindings to YAML
dt-bindings: i2c: migrate mt7621 text bindings to YAML
dt-bindings: power: gpcv2: correct patternProperties
dt-bindings: virtio: Convert virtio,pci-iommu to DT schema
dt-bindings: timer: arm,arch_timer: Allow dual compatible string
dt-bindings: arm: cpus: Add kryo240 compatible
dt-bindings: display: bridge: nxp,tda998x: Convert to json-schema
dt-bindings: nvmem: u-boot,env: add basic NVMEM cells
dt-bindings: remoteproc: qcom,adsp: enforce smd-edge schema
...
When the thermal zone description was converted to yaml schema, the
required 'trips' property was forgotten.
The initial text bindings was describing:
"
[ ... ]
* Thermal zone nodes
The thermal zone node is the node containing all the required info
for describing a thermal zone, including its cooling device bindings. The
thermal zone node must contain, apart from its own properties, one sub-node
containing trip nodes and one sub-node containing all the zone cooling maps.
Required properties:
- polling-delay: The maximum number of milliseconds to wait between polls
Type: unsigned when checking this thermal zone.
Size: one cell
- polling-delay-passive: The maximum number of milliseconds to wait
Type: unsigned between polls when performing passive cooling.
Size: one cell
- thermal-sensors: A list of thermal sensor phandles and sensor specifier
Type: list of used while monitoring the thermal zone.
phandles + sensor
specifier
- trips: A sub-node which is a container of only trip point nodes
Type: sub-node required to describe the thermal zone.
Optional property:
- cooling-maps: A sub-node which is a container of only cooling device
Type: sub-node map nodes, used to describe the relation between trips
and cooling devices.
[ ... ]
"
Now the schema describes:
"
[ ... ]
required:
- polling-delay
- polling-delay-passive
- thermal-sensors
[ ... ]
"
Add the missing 'trips' property in the required properties.
Fixed: 1202a442a3 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220809085629.509116-3-daniel.lezcano@linaro.org
Pull devicetree updates from Rob Herring:
"Bindings:
- Add spi-peripheral-props.yaml references to various SPI device
bindings
- Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x,
skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm
CCN PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and
arm-firmware-suite bindings to DT schema format
- New bindings for Arm virtual platforms display, Qualcomm IMEM
memory region, Samsung S5PV210 ChipID, EM Microelectronic EM3027
RTC, and arm,cortex-a78ae
- Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec,
quanta, and densitron
- Add missing MSI and IOMMU properties to host-generic-pci
- Remove bindings for removed EFM32 platform
- Remove old chosen.txt binding (replaced by schema)
- Treewide add missing type information for properties
- Treewide fixing of typos and its vs. it's in bindings. Its all good
now.
- Drop unnecessary quoting in power related schemas
- Several LED binding updates which didn't get picked up
- Move various bindings to proper directories
DT core code:
- Convert unittest GPIO related tests to use fwnode
- Check ima-kexec-buffer against memory bounds
- Print reserved-memory allocation/reservation failures as errors
- Cleanup early_init_dt_reserve_memory_arch()
- Simplify of_overlay_fdt_apply() tail"
* tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (65 commits)
dt-bindings: mtd: microchip,mchp48l640: use spi-peripheral-props.yaml
dt-bindings: power: supply: drop quotes when not needed
dt-bindings: power: reset: drop quotes when not needed
dt-bindings: power: drop quotes when not needed
dt-bindings: PCI: host-generic-pci: Allow IOMMU and MSI properties
of/fdt: declared return type does not match actual return type
devicetree/bindings: correct possessive "its" typos
dt-bindings: net: convert emac_rockchip.txt to YAML
dt-bindings: eeprom: microchip,93lc46b: move to eeprom directory
dt-bindings: eeprom: at25: use spi-peripheral-props.yaml
dt-bindings: display: use spi-peripheral-props.yaml
dt-bindings: watchdog: qcom,pm8916-wdt: convert to dtschema
dt-bindings: power: reset: qcom,pon: use absolute path to other schema
dt-bindings: iio/dac: adi,ad5766: Add missing type to 'output-range-microvolts'
dt-bindings: power: supply: charger-manager: Add missing type for 'cm-battery-stat'
dt-bindings: panel: raydium,rm67191: Add missing type to 'video-mode'
of/fdt: Clean up early_init_dt_reserve_memory_arch()
dt-bindings: PCI: fsl,imx6q-pcie: Add missing type for 'reset-gpio-active-high'
dt-bindings: rtc: Add EM Microelectronic EM3027 bindings
dt-bindings: rtc: ds1307: Convert to json-schema
...
Pull thermal control updates from Rafael Wysocki:
"These start a rework of the handling of trip points in the thermal
core, improve the cpufreq/devfreq cooling device handling, update some
thermal control drivers and the tmon utility and clean up code.
Specifics:
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to
be used by the different sensors when registering a thermal zone
(Daniel Lezcano).
- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba).
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3
(Wolfram Sang).
- Convert the QCom tsens DT binding to the dtsformat format
(Krzysztof Kozlowski).
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano).
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof).
- Fix array underflow in prep_lookup_table (Dan Carpenter).
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun).
- Fix typos in comments detected on sun8i by Coccinelle (Julia
Lawall).
- Fix typos in comments on rzg2l (Biju Das).
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li).
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov).
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer).
- Fix typo in the comments for the 'tmon' tool (Slark Xiao).
- Make the thermal core use ida_alloc()/free() directly instead of
ida_simple_get()/ida_simple_remove() that have been deprecated
(keliu).
- Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal
control driver (Rafael Wysocki)"
* tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits)
thermal/of: Initialize trip points separately
thermal/of: Use thermal trips stored in the thermal zone
thermal/core: Add thermal_trip in thermal_zone
thermal/core: Rename 'trips' to 'num_trips'
thermal/core: Move thermal_set_delay_jiffies to static
thermal/core: Remove unneeded EXPORT_SYMBOLS
thermal/of: Move thermal_trip structure to thermal.h
thermal/of: Remove the device node pointer for thermal_trip
thermal/of: Replace device node match with device node search
thermal/core: Remove duplicate information when an error occurs
thermal/core: Avoid calling ->get_trip_temp() unnecessarily
thermal/tools/tmon: Fix typo 'the the' in comment
thermal/tools/tmon: Include pthread and time headers in tmon.h
thermal/ti-soc-thermal: Fix comment typo
thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
thermal/drivers/u8500: Remove unnecessary print function dev_err()
thermal/drivers/rzg2l: Fix comments
thermal/drivers/sun8i: Fix typo in comment
thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
...
Pull thermal control changes for 5.20-rc1 from Daniel Lezcano:
"- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba)
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn)
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
Sang)
- Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
Kozlowski)
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano)
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof)
- Fix array underflow in prep_lookup_table (Dan Carpenter)
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun)
- Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall)
- Fix typos in comments on rzg2l (Biju Das)
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li)
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov)
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer)
- Fix typo in the comments for the 'tmon' tool (Slark Xiao)
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to be
used by the different sensors when registering a thermal zone
(Daniel Lezcano)"
* tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (36 commits)
thermal/of: Initialize trip points separately
thermal/of: Use thermal trips stored in the thermal zone
thermal/core: Add thermal_trip in thermal_zone
thermal/core: Rename 'trips' to 'num_trips'
thermal/core: Move thermal_set_delay_jiffies to static
thermal/core: Remove unneeded EXPORT_SYMBOLS
thermal/of: Move thermal_trip structure to thermal.h
thermal/of: Remove the device node pointer for thermal_trip
thermal/of: Replace device node match with device node search
thermal/core: Remove duplicate information when an error occurs
thermal/core: Avoid calling ->get_trip_temp() unnecessarily
thermal/tools/tmon: Fix typo 'the the' in comment
thermal/tools/tmon: Include pthread and time headers in tmon.h
thermal/ti-soc-thermal: Fix comment typo
thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
thermal/drivers/u8500: Remove unnecessary print function dev_err()
thermal/drivers/rzg2l: Fix comments
thermal/drivers/sun8i: Fix typo in comment
thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
...
In order to replace the fsl,scu txt file from bindings/arm/freescale,
we need to split it between the right subsystems. This patch documents
separately the 'thermal' child node of the SCU main node.
Signed-off-by: Abel Vesa <abel.vesa@nxp.com>
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Pull devicetree updates from Rob Herring:
"Bindings:
- Convert smsc,lan91c111, qcom,spi-qup, qcom,msm-uartdm,
qcom,i2c-qup, qcom,gsbi, i2c-mt65xx, TI wkup_m3_ipc (and new
props), qcom,smp2p, TI timer, Mediatek gnss, Mediatek topckgen,
Mediatek apmixedsys, Mediatek infracfg, fsl,ls-extirq,
fsl,layerscape-dcfg, QCom PMIC SPMI, rda,8810pl-timer, Xilinx
zynqmp_ipi, uniphier-pcie, and Ilitek touchscreen controllers
- Convert various Arm Ltd peripheral IP bindings to schemas
- New bindings for Menlo board CPLD, DH electronics board CPLD,
Qualcomm Geni based QUP I2C, Renesas RZ/G2UL OSTM, Broafcom BCM4751
GNSS, MT6360 PMIC, ASIX USB Ethernet controllers, and
Microchip/SMSC LAN95xx USB Ethernet controllers
- Add vendor prefix for Enclustra
- Add various compatible string additions
- Various example fixes and cleanups
- Remove unused hisilicon,hi6220-reset binding
- Treewide fix properties missing type definition
- Drop some empty and unreferenced .txt bindings
- Documentation improvements for writing schemas
DT driver core:
- Drop static IRQ resources for DT platform devices as IRQ setup is
dynamic and drivers have all been converted to use
platform_get_irq() and friends
- Rework memory allocations and frees for overlays
- Continue overlay notifier callbacks on successful calls and add
unittests
- Handle 'interrupts-extended' in early DT IRQ setup
- Fix of_property_read_string() errors to match documentation
- Ignore disabled nodes in FDT API calls"
* tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (86 commits)
of/irq: fix typo in comment
dt-bindings: Fix properties without any type
Revert "dt-bindings: mailbox: qcom-ipcc: add missing properties into example"
dt-bindings: input: touchscreen: ilitek_ts_i2c: Absorb ili2xxx bindings
dt-bindings: timer: samsung,exynos4210-mct: define strict clock order
dt-bindings: timer: samsung,exynos4210-mct: drop unneeded minItems
dt-bindings: timer: cdns,ttc: drop unneeded minItems
dt-bindings: mailbox: zynqmp_ipi: convert to yaml
dt-bindings: usb: ci-hdrc-usb2: fix node node for ethernet controller
dt-bindings: net: add schema for Microchip/SMSC LAN95xx USB Ethernet controllers
dt-bindings: net: add schema for ASIX USB Ethernet controllers
of/fdt: Ignore disabled memory nodes
dt-bindings: arm: fix typos in compatible
dt-bindings: mfd: Add bindings child nodes for the Mediatek MT6360
dt-bindings: display: convert Arm Komeda to DT schema
dt-bindings: display: convert Arm Mali-DP to DT schema
dt-bindings: display: convert Arm HDLCD to DT schema
dt-bindings: display: convert PL110/PL111 to DT schema
dt-bindings: arm: convert vexpress-config to DT schema
dt-bindings: arm: convert vexpress-sysregs to DT schema
...
Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 J72XX supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220517172920.10857-2-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Pull devicetree fixes from Rob Herring:
- Drop unused 'max-link-speed' in Apple PCIe
- More redundant 'maxItems/minItems' schema fixes
- Support values for pinctrl 'drive-push-pull' and 'drive-open-drain'
- Fix redundant 'unevaluatedProperties' in MT6360 LEDs binding
- Add missing 'power-domains' property to Cadence UFSHC
* tag 'devicetree-fixes-for-5.18-3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux:
dt-bindings: pci: apple,pcie: Drop max-link-speed from example
dt-bindings: Drop redundant 'maxItems/minItems' in if/then schemas
dt-bindings: pinctrl: Allow values for drive-push-pull and drive-open-drain
dt-bindings: leds-mt6360: Drop redundant 'unevaluatedProperties'
dt-bindings: ufs: cdns,ufshc: Add power-domains
