Commit Graph

386 Commits

Author SHA1 Message Date
Linus Torvalds
2a17bb8c20 Merge tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
 "DT Bindings:

   - Drop duplicate devices in trivial-devices.yaml

   - Add a common serial peripheral device schema and reference it in
     serial device schemas.

   - Convert nxp,lpc1850-wdt, zii,rave-wdt, ti,davinci-wdt,
     snps,archs-pct, fsl,bcsr, fsl,fpga-qixis-i2c, fsl,fpga-qixis,
     fsl,cpm-enet, fsl,cpm-mdio, fsl,ucc-hdlc, maxim,ds26522,
     aspeed,ast2400-cvic, aspeed,ast2400-vic, fsl,ftm-timer,
     ti,davinci-timer, fsl,rcpm, and qcom,ebi2 to DT schema

   - Add support for rockchip,rk3576-wdt, qcom,apss-wdt-sa8255p,
     fsl,imx8qm-irqsteer, qcom,pm6150-vib, qcom,sa8255p-pdc,
     isil,isl69260, ti,tps546d24, and lpc32xx DMA mux

   - Drop duplicate nvidia,tegra186-ccplex-cluster.yaml and
     mediatek,mt6795-sys-clock.yaml

   - Add arm,gic ESPI and EPPI interrupt type specifiers

   - Add another batch of legacy compatible strings which we have no
     intention of documenting

   - Add dmas/dma-names properties to FSL lcdif

   - Fix wakeup-source reference to m8921-keypad.yaml

   - Treewide fixes of typos in bindings

  DT Core:

   - Update dtc/libfdt to upstream version v1.7.0-95-gbcd02b523429

   - More conversions to scoped iterators and __free() initializer

   - Handle overflows in address resources on 32-bit systems

   - Extend extracting compatible strings in sources from function
     parameters

   - Use of_property_present() in DT unittest

   - Clean-up of_irq_to_resource() to use helpers

   - Support #msi-cells=<0> in of_msi_get_domain()

   - Improve the kerneldoc for of_property_match_string()

   - kselftest: Ignore nodes that have ancestors disabled"

* tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (59 commits)
  dt-bindings: watchdog: Add rockchip,rk3576-wdt compatible
  dt-bindings: cpu: Drop duplicate nvidia,tegra186-ccplex-cluster.yaml
  dt-bindings: clock: mediatek: Drop duplicate mediatek,mt6795-sys-clock.yaml
  of/irq: Use helper to define resources
  of/irq: Make use of irq_get_trigger_type()
  dt-bindings: clk: vc5: Make SD/OE pin configuration properties not required
  drivers/of: Improve documentation for match_string
  of: property: Do some clean up with use of __free()
  dt-bindings: watchdog: qcom-wdt: document support on SA8255p
  dt-bindings: interrupt-controller: fsl,irqsteer: Document fsl,imx8qm-irqsteer
  dt-bindings: interrupt-controller: arm,gic: add ESPI and EPPI specifiers
  dt-bindings: dma: Add lpc32xx DMA mux binding
  dt-bindings: trivial-devices: Drop duplicate "maxim,max1237"
  dt-bindings: trivial-devices: Drop duplicate LM75 compatible devices
  dt-bindings: trivial-devices: Deprecate "ad,ad7414"
  dt-bindings: trivial-devices: Drop incorrect and duplicate at24 compatibles
  dt-bindings: wakeup-source: update reference to m8921-keypad.yaml
  dt-bindings: interrupt-controller: qcom-pdc: document support for SA8255p
  dt-bindings: Fix various typos
  of: address: Unify resource bounds overflow checking
  ...
2024-09-19 08:38:51 +02:00
Yu-Chun Lin
a7fcc23274 dt-bindings: Fix various typos
Corrected several typos in Documentation/devicetree/bindings files.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Kuan-Wei Chiu <visitorckw@gmail.com>
Reviewed-by: Matti Vaittinen <mazziesaccount@gmail.com>
Signed-off-by: Yu-Chun Lin <eleanor15x@gmail.com>
Link: https://lore.kernel.org/r/20240905151943.2792056-1-eleanor15x@gmail.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2024-09-13 14:01:34 -05:00
Nikunj Kela
f41e6475ff dt-bindings: thermal: tsens: document support on SA8255p
Add compatible for sensors representing support on SA8255p.

Signed-off-by: Nikunj Kela <quic_nkela@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240828203721.2751904-14-quic_nkela@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-09-02 13:12:54 +02:00
George Stark
77545bdfe4 dt-bindings: thermal: amlogic,thermal: add optional power-domains
On newer SoCs, the thermal hardware can require a power domain to
operate so add corresponding optional property.

Signed-off-by: George Stark <gnstark@salutedevices.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240710223214.2348418-3-gnstark@salutedevices.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-09-02 12:43:20 +02:00
Linus Torvalds
0ffb8a4c96 Merge tag 'devicetree-for-6.11' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
 "DT Bindings:

   - Convert and add a bunch of IBM FSI related bindings

   - Add a new schema listing legacy compatibles which will (probably)
     never be documented. This will silence various checks warning about
     them.

   - Add bindings for Sierra Wireless mangOH Green SPI IoT interface,
     new Arm 2024 Cortex and Neoverse CPUs, QCom sc8180x PDC, QCom SDX75
     GPI DMA, imx8mp/imx8qxp fsl,irqsteer, and Renesas RZ/G2UL CRU and
     CSI-2 blocks

   - Convert Spreadtrum sprd-timer, FSL cpm_qe, FSL fsl,ls-scfg-msi, FSL
     q(b)man-*, FSL qoriq-mc, and img,pdc-wdt bindings to DT schema

   - Drop obsolete stericsson,abx500.txt

  DT core:

   - Update dtc to upstream version v1.7.0-93-g1df7b047fe43

   - Add support to run DT validation on DTs with applied overlays

   - Add helper for creating boolean properties in dynamic nodes and use
     that for dynamic PCI nodes

   - Clean-up early parsing of '#{address,size}-cells'"

* tag 'devicetree-for-6.11' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (39 commits)
  dt-bindings: timer: sprd-timer: convert to YAML
  dt-bindings: incomplete-devices: document devices without bindings
  dt-bindings: trivial-devices: document the Sierra Wireless mangOH Green SPI IoT interface
  scripts/dtc: Update to upstream version v1.7.0-93-g1df7b047fe43
  dt-bindings: soc: fsl: Add fsl,ls1028a-reset for reset syscon node
  dt-bindings: soc: fsl: cpm_qe: convert to yaml format
  dt-bindings: i2c: i2c-fsi: Convert to json-schema
  dt-bindings: fsi: Document the FSI Hub Controller
  dt-bindings: fsi: Document the AST2700 FSI controller
  dt-bindings: fsi: ast2600-fsi-master: Convert to json-schema
  dt-bindings: fsi: ibm,i2cr-fsi-master: Reference common FSI controller
  dt-bindings: fsi: Document the FSI controller common properties
  dt-bindings: fsi: Document the IBM SBEFIFO engine
  dt-bindings: fsi: p9-occ: Convert to json-schema
  dt-bindings: fsi: Document the IBM SCOM engine
  dt-bindings: fsi: fsi2spi: Document SPI controller child nodes
  dt-bindings: interrupt-controller: convert fsl,ls-scfg-msi to yaml
  dt-bindings: soc: fsl: Convert q(b)man-* to yaml format
  dt-bindings: misc: fsl,qoriq-mc: convert to yaml format
  dt-bindings: drop stale Anson Huang from maintainers
  ...
2024-07-17 18:07:31 -07:00
Rob Herring (Arm)
6f48290b1a dt-bindings: thermal: Drop 'trips' node as required
It is possible to have thermal zones which don't have any trip points.
These zones in effect simply represent a temperature sensor without any
action associated with it. While the schema has always required a
'trips' node, users have existed for a long time without it. Update the
schema to match reality.

Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709150154.3272825-1-robh@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
fd1f85b2e7 dt-bindings: thermal: qoriq: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-12-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
f062dc5cca dt-bindings: thermal: cleanup examples indentation
Preferred indentation for DTS examples in the bindings is 4-space.  It
is also preferred not to have redundant/unused labels. No functional
change

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-22-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
bbb4c17939 dt-bindings: thermal: simplify few bindings
Simplify few bindings which already reference thermal-sensor.yaml schema
by dropping unneeded requiring of '#thermal-sensor-cells' and dropping
assigned-clocks properties (core schema allows it if 'clocks' are
there).

Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-21-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
a985dceccd dt-bindings: thermal: ti,j72xx: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-20-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
323a6134e7 dt-bindings: thermal: ti,am654: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-19-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
17cdc4717d dt-bindings: thermal: st,stm32: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-18-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
f9b2d6b840 dt-bindings: thermal: sprd: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-17-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
28b3175105 dt-bindings: thermal: socionext,uniphier: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-16-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
bf1163bb00 dt-bindings: thermal: rzg2l: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-15-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
9abcf4ac35 dt-bindings: thermal: rockchip: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-14-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
7410853a1d dt-bindings: thermal: rcar-gen3: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-13-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
80c3fda5de dt-bindings: thermal: qcom-tsens: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-11-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
c1bca276d8 dt-bindings: thermal: qcom-spmi-adc-tm5: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-10-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
df300226f6 dt-bindings: thermal: qcom-spmi-adc-tm-hc: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-9-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
b760aeec3d dt-bindings: thermal: nvidia,tegra30-tsensor: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-8-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
b6f4d62c53 dt-bindings: thermal: nvidia,tegra186-bpmp: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-7-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
57fa7d6687 dt-bindings: thermal: imx8mm: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-6-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
2410427cc8 dt-bindings: thermal: generic-adc: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-5-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
0ae2a1a614 dt-bindings: thermal: brcm,avs-ro: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Florian Fainelli <florian.fainelli@broadcom.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-4-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
e8eca74902 dt-bindings: thermal: allwinner,sun8i-a83t-ths: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Chen-Yu Tsai <wens@csie.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-3-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
da1f72fbe7 dt-bindings: thermal: amlogic: reference thermal-sensor schema
Device is a thermal sensor and all in-tree DTS provide
'#thermal-sensor-cells', so reference the thermal-sensor.yaml to
simplify it, bring the common definition of '#thermal-sensor-cells'
property and require it.

Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Guillaume LA ROQUE <glaroque@baylibre.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-2-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
f5a890927e dt-bindings: thermal: samsung,exynos: specify cells
All Samsung Exynos SoCs Thermal Management Units have only one sensor,
so make '#thermal-sensor-cells' fixed at 0.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-1-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
97e32381d0 dt-bindings: thermal: correct thermal zone node name limit
Linux kernel uses thermal zone node name during registering thermal
zones and has a hard-coded limit of 20 characters, including terminating
NUL byte.  The bindings expect node names to finish with '-thermal'
which is eight bytes long, thus we have only 11 characters for the reset
of the node name (thus 10 for the pattern after leading fixed character).

Reported-by: Rob Herring <robh@kernel.org>
Closes: https://lore.kernel.org/all/CAL_JsqKogbT_4DPd1n94xqeHaU_J8ve5K09WOyVsRX3jxxUW3w@mail.gmail.com/
Fixes: 1202a442a3 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Cc: stable@vger.kernel.org
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240702145248.47184-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Abel Vesa
b18ce693a2 dt-bindings: thermal: qcom-tsens: Document the X1E80100 Temperature Sensor
Document the Temperature Sensor (TSENS) on the X1E80100 Platform.

Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Abel Vesa <abel.vesa@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20240628-x1e80100-bindings-thermal-qcom-tsens-v2-1-4843d4c2ba24@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Abdulrasaq Lawani
bb6972fad9 dt-bindings: thermal: convert hisilicon-thermal.txt to dt-schema
Convert the hisilicon SoCs tsensor txt bindings to dt-schema

Signed-off-by: Abdulrasaq Lawani <abdulrasaqolawani@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240618-hisilicon-thermal-dt-bindings-conversion-v4-1-7eba97fbe6d0@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
499f5e3c7c dt-bindings: drop stale Anson Huang from maintainers
Emails to Anson Huang bounce:

  Diagnostic-Code: smtp; 550 5.4.1 Recipient address rejected: Access denied.

Add IMX platform maintainers for bindings which would become orphaned.

Acked-by: Uwe Kleine-König <ukleinek@kernel.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Acked-by: Peng Fan <peng.fan@nxp.com>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com> # for I2C
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> # for IIO
Acked-by: Andi Shyti <andi.shyti@kernel.org>
Acked-by: Abel Vesa <abel.vesa@linaro.org>
Link: https://lore.kernel.org/r/20240617065828.9531-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2024-07-09 07:40:17 -06:00
Binbin Zhou
c8c4353685 dt-bindings: thermal: loongson,ls2k-thermal: Fix incorrect compatible definition
The temperature output register of the Loongson-2K2000 is defined in the
chip configuration domain, which is different from the Loongson-2K1000,
so it can't be fallbacked.

We need to use two groups of registers to describe it: the first group
is the high and low temperature threshold setting register; the second
group is the temperature output register.

It is true that this fix will cause ABI corruption, but it is necessary
otherwise the Loongson-2K2000 temperature sensor will not work properly.

Fixes: 72684d99a8 ("thermal: dt-bindings: add loongson-2 thermal")
Cc: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Huacai Chen <chenhuacai@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/5198999d679f1a1c3457385acb9fadfc85da1f1e.1713837379.git.zhoubinbin@loongson.cn
2024-04-23 12:40:30 +02:00
Binbin Zhou
25c7d8472f dt-bindings: thermal: loongson,ls2k-thermal: Add Loongson-2K0500 compatible
The thermal on the Loongson-2K0500 shares the design with the
Loongson-2K1000. Define corresponding compatible string, having the
loongson,ls2k1000-thermal as a fallback.

Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Huacai Chen <chenhuacai@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/26524a63abd2d032e4c45efe6ce3fedb46841768.1713837379.git.zhoubinbin@loongson.cn
2024-04-23 12:40:30 +02:00
Nicolas Pitre
78c88534e5 dt-bindings: thermal: mediatek: Add LVTS thermal controller definition for MT8188
Add LVTS thermal controller definition for MT8188.

Signed-off-by: Nicolas Pitre <npitre@baylibre.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240402032729.2736685-13-nico@fluxnic.net
2024-04-23 12:40:30 +02:00
Nicolas Pitre
a2ca202350 dt-bindings: thermal: mediatek: Add LVTS thermal controller definition for MT8186
Add LVTS thermal controller definition for MT8186.

Signed-off-by: Nicolas Pitre <npitre@baylibre.com>
Acked-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240402032729.2736685-7-nico@fluxnic.net
2024-04-23 12:40:30 +02:00
Dmitry Rokosov
63d96b1253 dt-bindings: thermal: amlogic: add support for A1 thermal sensor
Provide right compatible properties for Amlogic A1 Thermal Sensor
controller. A1 family supports only one thermal node - CPU thermal
sensor.

Signed-off-by: Dmitry Rokosov <ddrokosov@salutedevices.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240328191322.17551-2-ddrokosov@salutedevices.com
2024-04-23 12:40:29 +02:00
Raphael Gallais-Pou
ff96922d33 dt-bindings: thermal: convert st,stih407-thermal to DT schema
'st,passive_colling_temp' does not appear in the device-tree, 'reg' and
'#thermal-sensor-cells' are also missing in the device description.

Convert st,stih407-thermal binding to DT schema format in order to clean
unused 'st,passive_cooling_temp' and add missing properties.

Signed-off-by: Raphael Gallais-Pou <rgallaispou@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240320-thermal-v3-1-700296694c4a@gmail.com
2024-04-23 12:40:29 +02:00
Konrad Dybcio
c0f14ec952 dt-bindings: thermal: lmh: Add QCM2290 compatible
Document the QCM2290 LMH.

Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240308-topic-rb1_lmh-v2-1-bac3914b0fe3@linaro.org
2024-04-23 12:40:29 +02:00
Linus Torvalds
ed302ad52b Merge tag 'thermal-6.9-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
 "These update thermal drivers for ARM platforms by adding new hardware
  support (r8a779h0, H616 THS), addressing issues (Mediatek LVTS,
  Mediatek MT7896, thermal-of) and cleaning up code.

  Specifics:

   - Fix memory leak in the error path at probe time in the Mediatek
     LVTS driver (Christophe Jaillet)

   - Fix control buffer enablement regression on Meditek MT7896 (Frank
     Wunderlich)

   - Drop spaces before TABs in different places: thermal-of, ST drivers
     and Makefile (Geert Uytterhoeven)

   - Adjust DT binding for NXP as fsl,tmu-range min/maxItems can vary
     among several SoC versions (Fabio Estevam)

   - Add support for the H616 THS controller on Sun8i platforms (Martin
     Botka)

   - Don't fail probe due to zone registration failure because there is
     no trip points defined in the DT (Mark Brown)

   - Support variable TMU array size for new platforms (Peng Fan)

   - Adjust the DT binding for thermal-of and make the polling time not
     required and assume it is zero when not found in the DT (Konrad
     Dybcio)

   - Add r8a779h0 support in both the DT and the rcar_gen3 driver (Geert
     Uytterhoeven)"

* tag 'thermal-6.9-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
  thermal/drivers/rcar_gen3: Add support for R-Car V4M
  dt-bindings: thermal: rcar-gen3-thermal: Add r8a779h0 support
  thermal/of: Assume polling-delay(-passive) 0 when absent
  dt-bindings: thermal-zones: Don't require polling-delay(-passive)
  thermal/drivers/qoriq: Fix getting tmu range
  thermal/drivers/sun8i: Don't fail probe due to zone registration failure
  thermal/drivers/sun8i: Add support for H616 THS controller
  thermal/drivers/sun8i: Add SRAM register access code
  thermal/drivers/sun8i: Extend H6 calibration to support 4 sensors
  thermal/drivers/sun8i: Explain unknown H6 register value
  dt-bindings: thermal: sun8i: Add H616 THS controller
  soc: sunxi: sram: export register 0 for THS on H616
  dt-bindings: thermal: qoriq-thermal: Adjust fsl,tmu-range min/maxItems
  thermal: Drop spaces before TABs
  thermal/drivers/mediatek: Fix control buffer enablement on MT7896
  thermal/drivers/mediatek/lvts_thermal: Fix a memory leak in an error handling path
2024-03-19 11:11:01 -07:00
Duy Nguyen
6796c1b68f dt-bindings: thermal: rcar-gen3-thermal: Add r8a779h0 support
Document support for the Thermal Sensor/Chip Internal Voltage
Monitor/Core Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4M
(R8A779H0) SoC.

Just like on other R-Car Gen4 SoCs, interrupts are not routed to the
INTC-AP (GIC) but to the Error Control Module (ECM).

Signed-off-by: Duy Nguyen <duy.nguyen.rh@renesas.com>
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/b3d135f8b63b9fe2d0f0aa2e48c8a2211b2e947e.1709722342.git.geert+renesas@glider.be
2024-03-11 17:14:46 +01:00
Konrad Dybcio
8d5d6abf28 dt-bindings: thermal-zones: Don't require polling-delay(-passive)
Currently, thermal zones associated with providers that have interrupts
for signaling hot/critical trips are required to set a polling-delay
of 0 to indicate no polling. This feels a bit backwards.

Assume 0 (no polling) when these properties are not defined.

Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240125-topic-thermal-v1-1-3c9d4dced138@linaro.org
2024-03-11 17:14:46 +01:00
Martin Botka
d1dc7ee560 dt-bindings: thermal: sun8i: Add H616 THS controller
This controller is similar to the H6, but covers four sensors and uses
slightly different calibration methods.
Also the H616 requires to poke a bit in the SYS_CFG register range for
correct operation, so add a phandle property to point there.

Signed-off-by: Martin Botka <martin.botka@somainline.org>
Signed-off-by: Andre Przywara <andre.przywara@arm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Vasily Khoruzhick <anarsoul@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240219153639.179814-3-andre.przywara@arm.com
2024-03-11 17:14:46 +01:00
Fabio Estevam
dd01475a03 dt-bindings: thermal: qoriq-thermal: Adjust fsl,tmu-range min/maxItems
The number of fsl,tmu-range entries vary among the several NXP SoCs.

- lx2160a has two fsl,tmu-range entries  (fsl,qoriq-tmu compatible)
- imx8mq has four fsl,tmu-range entries. (fsl,imx8mq-tmu compatible)
- imx93 has seven fsl,tmu-range entries. (fsl,qoriq-tmu compatible)

Change minItems and maxItems accordingly.

This fixes the following schema warning:

imx93-11x11-evk.dtb: tmu@44482000: fsl,tmu-range: 'oneOf' conditional failed, one must be fixed:
        [2147483866, 2147483881, 2147483906, 2147483946, 2147484006, 2147484071, 2147484086] is too long

Signed-off-by: Fabio Estevam <festevam@denx.de>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240104124952.1975160-1-festevam@gmail.com
2024-03-11 17:14:46 +01:00
Biju Das
f1eb64bf6d dt-bindings: mfd: dlg,da9063: Convert da9062 to json-schema
Convert the da9062 PMIC device tree binding documentation to json-schema.

Document the missing gpio child node for da9062.

While at it, update description with link to product information and
example.

The missing child node with of_compatible defined in MFD_CELL_OF is
causing the below warning message:
da9062-gpio: Failed to locate of_node [id: -1]

So, make all child nodes with of_compatible defined in struct mfd_cell
as required property for da906{1,2} devices.

The "gpio-controller" and "#gpio-cells" properties are defined in the
parent instead of gpio child node as there are existing driver users
based on these parent properties.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Link: https://lore.kernel.org/r/20240131102656.3379-7-biju.das.jz@bp.renesas.com
Signed-off-by: Lee Jones <lee@kernel.org>
2024-02-08 13:06:03 +00:00
Biju Das
fddee1e686 dt-bindings: thermal: Convert da906{1,2} thermal to json-schema
Convert the da906{1,2} thermal device tree binding documentation to
json-schema.

Update MAINTAINERS entries and description by referring to
dlg,da9062-thermal.yaml binding file.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20240131102656.3379-5-biju.das.jz@bp.renesas.com
Signed-off-by: Lee Jones <lee@kernel.org>
2024-02-08 13:05:52 +00:00
Johan Hovold
4bddb0cdfa dt-bindings: thermal: qcom-spmi-adc-tm5/hc: Clean up examples
Clean up the examples by adding newline separators, moving 'reg'
properties after 'compatible' and dropping unused labels.

Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231130174114.13122-3-johan+linaro@kernel.org
2024-01-02 09:33:18 +01:00
Johan Hovold
7ec597ba25 dt-bindings: thermal: qcom-spmi-adc-tm5/hc: Fix example node names
The ADC Thermal Monitor is part of an SPMI PMIC, which in turn sits on
an SPMI bus.

Fixes: db03874b85 ("dt-bindings: thermal: qcom: add HC variant of adc-thermal monitor bindings")
Fixes: e8ffd6c075 ("dt-bindings: thermal: qcom: add adc-thermal monitor bindings")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231130174114.13122-2-johan+linaro@kernel.org
2024-01-02 09:33:18 +01:00
Maxim Kiselev
20bf6262d5 dt-bindings: thermal: sun8i: Add binding for D1/T113s THS controller
Add a binding for D1/T113s thermal sensor controller.

Signed-off-by: Maxim Kiselev <bigunclemax@gmail.com>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231217210629.131486-2-bigunclemax@gmail.com
2024-01-02 09:33:18 +01:00
Fabio Estevam
87f67d1747 dt-bindings: thermal-zones: Document critical-action
Document the critical-action property to describe the thermal action
the OS should perform after the critical temperature is reached.

The possible values are "shutdown" and "reboot".

The motivation for introducing the critical-action property is that
different systems may need different thermal actions when the critical
temperature is reached.

For example, in a desktop PC, it is desired that a shutdown happens
after the critical temperature is reached.

However, in some embedded cases, such behavior does not suit well,
as the board may be unattended in the field and rebooting may be a
better approach.

The bootloader may also benefit from this new property as it can check
the SoC temperature and in case the temperature is above the critical
point, it can trigger a shutdown or reboot accordingly.

Signed-off-by: Fabio Estevam <festevam@denx.de>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231129124330.519423-1-festevam@gmail.com
2024-01-02 09:33:18 +01:00