AM69 Starter Kit is a single board designed for TI AM69 SoC.
The AM69 SoC belongs to the K3 Multicore SoC architecture platform,
providing advanced system integration in automotive ADAS applications,
autonomous mobile robot and edge AI applications.
Add DT binding for AM69 Starter Kit.
Signed-off-by: Dasnavis Sabiya <sabiya.d@ti.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Link: https://lore.kernel.org/r/20230119132958.124435-2-sabiya.d@ti.com
The Devicetree bindings document does not have to say in the title that
it is a "Devicetree binding", but instead just describe the hardware.
Drop trailing "Devicetree bindings" in various forms (also with
trailing full stop):
find Documentation/devicetree/bindings/ -type f -name '*.yaml' \
-not -name 'trivial-devices.yaml' \
-exec sed -i -e 's/^title: \(.*\) [dD]evice[ -]\?[tT]ree [bB]indings\?\.\?$/title: \1/' {} \;
find Documentation/devicetree/bindings/ -type f -name '*.yaml' \
-not -name 'trivial-devices.yaml' \
-exec sed -i -e 's/^title: \(.*\) [dD]evice[ -]\?[nN]ode [bB]indings\?\.\?$/title: \1/' {} \;
find Documentation/devicetree/bindings/ -type f -name '*.yaml' \
-not -name 'trivial-devices.yaml' \
-exec sed -i -e 's/^title: \(.*\) [dD][tT] [bB]indings\?\.\?$/title: \1/' {} \;
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> # IIO
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media
Acked-by: Sebastian Reichel <sre@kernel.org> # power
Link: https://lore.kernel.org/r/20221216163815.522628-5-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring <robh@kernel.org>
The AM62 SoC family is the follow on AM335x built on K3 Multicore SoC
architecture platform, providing ultra-low-power modes, dual display,
multi-sensor edge compute, security and other BOM-saving integration.
The AM62 SoC targets broad market to enable applications such as
Industrial HMI, PLC/CNC/Robot control, Medical Equipment, Building
Automation, Appliances and more.
Some highlights of this SoC are:
* Quad-Cortex-A53s (running up to 1.4GHz) in a single cluster.
Pin-to-pin compatible options for single and quad core are available.
* Cortex-M4F for general-purpose or safety usage.
* Dual display support, providing 24-bit RBG parallel interface and
OLDI/LVDS-4 Lane x2, up to 200MHz pixel clock support for 2K display
resolution.
* Selectable GPUsupport, up to 8GFLOPS, providing better user experience
in 3D graphic display case and Android.
* PRU(Programmable Realtime Unit) support for customized programmable
interfaces/IOs.
* Integrated Giga-bit Ethernet switch supporting up to a total of two
external ports (TSN capable).
* 9xUARTs, 5xSPI, 6xI2C, 2xUSB2, 3xCAN-FD, 3x eMMC and SD, GPMC for
NAND/FPGA connection, OSPI memory controller, 3xMcASP for audio,
1x CSI-RX-4L for Camera, eCAP/eQEP, ePWM, among other peripherals.
* Dedicated Centralized System Controller for Security, Power, and
Resource Management.
* Multiple low power modes support, ex: Deep sleep,Standby, MCU-only,
enabling battery powered system design.
AM625 is the first device of the family. Add DT bindings for the same.
More details can be found in the Technical Reference Manual:
https://www.ti.com/lit/pdf/spruiv7
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20220225120239.1303821-3-vigneshr@ti.com
Add compatibles for j721e and j7200 evms to allow for newer platforms
to distinguish themselves.
While doing this, maintain support for older style of description where
the board compatibility was not required.
Signed-off-by: Nishanth Menon <nm@ti.com>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Suman Anna <s-anna@ti.com>
Link: https://lore.kernel.org/r/20210925201430.11678-2-nm@ti.com
The AM642 SoC belongs to the K3 Multicore SoC architecture platform,
providing advanced system integration to enable applications such as
Motor Drives, PLC, Remote IO and IoT Gateways.
Some highlights of this SoC are:
* Dual Cortex-A53s in a single cluster, two clusters of dual Cortex-R5F
MCUs, and a single Cortex-M4F.
* Two Gigabit Industrial Communication Subsystems (ICSSG).
* Integrated Ethernet switch supporting up to a total of two external
ports.
* PCIe-GEN2x1L, USB3/USB2, 2xCAN-FD, eMMC and SD, UFS, OSPI memory
controller, QSPI, I2C, eCAP/eQEP, ePWM, ADC, among other
peripherals.
* Centralized System Controller for Security, Power, and Resource
Management (DMSC).
See AM64X Technical Reference Manual (SPRUIM2, Nov 2020)
for further details: https://www.ti.com/lit/pdf/spruim2
Signed-off-by: Dave Gerlach <d-gerlach@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Tested-by: Kishon Vijay Abraham I <kishon@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Grygorii Strashko <grygorii.strashko@ti.com>
Link: https://lore.kernel.org/r/20210226144257.5470-2-d-gerlach@ti.com
The J7200 SoC is a part of the K3 Multicore SoC architecture platform.
It is targeted for automotive gateway, vehicle compute systems,
Vehicle-to-Vehicle (V2V) and Vehicle-to-Everything (V2X) applications.
The SoC aims to meet the complex processing needs of modern embedded
products.
Some highlights of this SoC are:
* Dual Cortex-A72s in a single cluster, two clusters of lockstep
capable dual Cortex-R5F MCUs and a Centralized Device Management and
Security Controller (DMSC).
* Configurable L3 Cache and IO-coherent architecture with high data
throughput capable distributed DMA architecture under NAVSS.
* Integrated Ethernet switch supporting up to a total of 4 external ports
in addition to legacy Ethernet switch of up to 2 ports.
* Upto 1 PCIe-GEN3 controller, 1 USB3.0 Dual-role device subsystems,
20 MCANs, 3 McASP, eMMC and SD, OSPI/HyperBus memory controller, I3C and
I2C, eCAP/eQEP, eHRPWM among other peripherals.
* One hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
management.
See J7200 Technical Reference Manual (SPRUIU1, June 2020)
for further details: https://www.ti.com/lit/pdf/spruiu1
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Grygorii Strashko <grygorii.strashko@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Suman Anna <s-anna@ti.com>
Link: https://lore.kernel.org/r/20200914162231.2535-4-lokeshvutla@ti.com
