Pull more thermal control updates from Rafael Wysocki:
"These are mostly updates of thermal control drivers for ARM platforms,
new thermal control support for Loongson-2 and a couple of core
cleanups made possible by recent changes merged previously.
Specifics:
- Check if the Tegra BPMP supports the trip points in order to set
the .set_trips callback (Mikko Perttunen)
- Add new Loongson-2 thermal sensor along with the DT bindings (Yinbo
Zhu)
- Use IS_ERR_OR_NULL() helper to replace a double test on the TI
bandgap sensor (Li Zetao)
- Remove redundant platform_set_drvdata() calls, as there are no
corresponding calls to platform_get_drvdata(), from a bunch of
drivers (Andrei Coardos)
- Switch the Mediatek LVTS mode to filtered in order to enable
interrupts (Nícolas F. R. A. Prado)
- Fix Wvoid-pointer-to-enum-cast warning on the Exynos TMU (Krzysztof
Kozlowski)
- Remove redundant dev_err_probe(), because the underlying function
already called it, from the Mediatek sensor (Chen Jiahao)
- Free calibration nvmem after reading it on sun8i (Mark Brown)
- Remove useless comment from the sun8i driver (Yangtao Li)
- Make tsens_xxxx_nvmem static to fix a sparse warning on QCom tsens
(Min-Hua Chen)
- Remove error message at probe deferral on imx8mm (Ahmad Fatoum)
- Fix parameter check in lvts_debugfs_init() with IS_ERR() on
Mediatek LVTS (Minjie Du)
- Fix interrupt routine and configuratoin for Mediatek LVTS (Nícolas
F. R. A. Prado)
- Drop unused .get_trip_type(), .get_trip_temp() and .get_trip_hyst()
thermal zone callbacks from the core and rework the .get_trend()
one to take a trip point pointer as an argument (Rafael Wysocki)"
* tag 'thermal-6.6-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (29 commits)
thermal: core: Rework .get_trend() thermal zone callback
thermal: core: Drop unused .get_trip_*() callbacks
thermal/drivers/tegra-bpmp: Check if BPMP supports trip points
thermal: dt-bindings: add loongson-2 thermal
thermal/drivers/loongson-2: Add thermal management support
thermal/drivers/ti-soc-thermal: Use helper function IS_ERR_OR_NULL()
thermal/drivers/generic-adc: Removed unneeded call to platform_set_drvdata()
thermal/drivers/max77620_thermal: Removed unneeded call to platform_set_drvdata()
thermal/drivers/mediatek/auxadc_thermal: Removed call to platform_set_drvdata()
thermal/drivers/sun8i_thermal: Remove unneeded call to platform_set_drvdata()
thermal/drivers/broadcom/brcstb_thermal: Removed unneeded platform_set_drvdata()
thermal/drivers/mediatek/lvts_thermal: Make readings valid in filtered mode
thermal/drivers/k3_bandgap: Remove unneeded call to platform_set_drvdata()
thermal/drivers/k3_j72xx_bandgap: Removed unneeded call to platform_set_drvdata()
thermal/drivers/broadcom/sr-thermal: Removed call to platform_set_drvdata()
thermal/drivers/samsung: Fix Wvoid-pointer-to-enum-cast warning
thermal/drivers/db8500: Remove redundant of_match_ptr()
thermal/drivers/mediatek: Clean up redundant dev_err_probe()
thermal/drivers/sun8i: Free calibration nvmem after reading it
thermal/drivers/sun8i: Remove unneeded comments
...
Pull devicetree updates from Rob Herring:
"DT core:
- Add support for generating DT nodes for PCI devices. This is the
groundwork for applying overlays to PCI devices containing
non-discoverable downstream devices.
- DT unittest additions to check reverted changesets, to test for
refcount issues, and to test unresolved symbols. Also, various
clean-ups of the unittest along the way.
- Refactor node and property manipulation functions to better share
code with old API and changeset API
- Refactor changeset print functions to a common implementation
- Move some platform_device specific functions into of_platform.c
Bindings:
- Treewide fixing of typos
- Treewide clean-up of SPDX tags to use 'OR' consistently
- Last chunk of dropping unnecessary quotes. With that, the check for
unnecessary quotes is enabled in yamllint.
- Convert ftgmac100, zynqmp-genpd, pps-gpio, syna,rmi4, and qcom,ssbi
bindings to DT schema format
- Add Allwinner V3s xHCI USB, Saef SF-TC154B display, QCom SM8450
Inline Crypto Engine, QCom SM6115 UFS, QCom SDM670 PDC interrupt
controller, Arm 2022 Cortex cores, and QCom IPQ9574 Crypto bindings
- Fixes for Rockchip DWC PCI binding
- Ensure all properties are evaluated on USB connector schema
- Fix dt-check-compatible script to find of_device_id instances with
compiler annotations"
* tag 'devicetree-for-6.6' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (64 commits)
dt-bindings: usb: Add V3s compatible string for OHCI
dt-bindings: usb: Add V3s compatible string for EHCI
dt-bindings: display: panel: mipi-dbi-spi: add Saef SF-TC154B
dt-bindings: vendor-prefixes: document Saef Technology
dt-bindings: thermal: lmh: update maintainer address
of: unittest: Fix of_unittest_pci_node() kconfig dependencies
dt-bindings: crypto: ice: Document sm8450 inline crypto engine
dt-bindings: ufs: qcom: Add ICE to sm8450 example
dt-bindings: ufs: qcom: Add sm6115 binding
dt-bindings: ufs: qcom: Add reg-names property for ICE
dt-bindings: yamllint: Enable quoted string check
dt-bindings: Drop remaining unneeded quotes
of: unittest-data: Fix whitespace - angular brackets
of: unittest-data: Fix whitespace - indentation
of: unittest-data: Fix whitespace - blank lines
of: unittest-data: Convert remaining overlay DTS files to sugar syntax
of: overlay: unittest: Add test for unresolved symbol
of: unittest: Add separators to of_unittest_overlay_high_level()
of: unittest: Cleanup partially-applied overlays
of: unittest: Merge of_unittest_apply{,_revert}_overlay_check()
...
Convert the Tegra thermal bindings from the free-form text format to
json-schema.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Since the SoC compatibles must be followed by the IP version compatible
(e.g. compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1";) it is
redundant to list all the SoC compatibles again in the if statement.
It will already match the IP-version compatible.
The list has already become inconsistent since for example
"qcom,msm8939-tsens" is covered by the if statement but is not listed
there explicitly like the other SoCs.
Simplify this by dropping the redundant SoC compatibles. ipq8064 and
msm8960 are still needed because they do not have an IP-version
compatible.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-4-5eb632235ba7@kernkonzept.com
Pull more thermal control updates from Rafael Wysocki:
"These are mostly cleanups on top of the previously merged thermal
control changes plus some driver fixes and the removal of the Intel
Menlow thermal driver.
Specifics:
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
check warning (Stefan Wahren)
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten)
- Fix comments for the cpuidle_cooling_register() function to match
the function prototype (Chenggang Wang)
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno)
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen)
- Use of_address_to_resource() in the Mediatek driver (Rob Herring)
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski)
- Clean up the step-wise thermal governor (Zhang Rui)
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano)
- Clean up the ACPI thermal driver a bit (Daniel Lezcano)
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki)"
* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
dt-bindings: thermal: qcom-tsens: Correct unit address
thermal/drivers/mediatek: Use of_address_to_resource()
thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
thermal/drivers/mediatek: Add temperature constraints to validate read
Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
thermal/drivers/cpuidle_cooling: Delete unmatched comments
dt-bindings: thermal: Use generic ADC node name in examples
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
Pull devicetree updates from Rob Herring:
"DT core:
- Add node lifecycle unit tests
- Add of_property_present() helper aligned with fwnode API
- Print more information on reserved regions on boot
- Update dtc to upstream v1.6.1-66-gabbd523bae6e
- Use strscpy() to instead of strncpy() in DT core
- Add option for schema validation on %.dtb targets
Bindings:
- Add/fix support for listing multiple patterns in DT_SCHEMA_FILES
- Rework external memory controller/bus bindings to properly support
controller specific child node properties
- Convert loongson,ls1x-intc, fcs,fusb302, sil,sii8620, Rockchip
RK3399 PCIe, Synquacer I2C, and Synquacer EXIU bindings to DT
schema format
- Add RiscV SBI PMU event mapping binding
- Add missing contraints on Arm SCMI child node allowed properties
- Add a bunch of missing Socionext UniPhier glue block bindings and
example fixes
- Various fixes for duplicate or conflicting type definitions on DT
properties"
* tag 'devicetree-for-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (66 commits)
dt-bindings: regulator: Add mps,mpq7932 power-management IC
of: dynamic: Fix spelling mistake "kojbect" -> "kobject"
dt-bindings: drop Sagar Kadam from SiFive binding maintainership
dt-bindings: sram: qcom,imem: document sm8450
dt-bindings: interrupt-controller: convert loongson,ls1x-intc.txt to json-schema
dt-bindings: arm: Add Cortex-A715 and X3
of: dynamic: add lifecycle docbook info to node creation functions
of: add consistency check to of_node_release()
of: do not use "%pOF" printk format on node with refcount of zero
of: unittest: add node lifecycle tests
of: update kconfig unittest help
of: add processing of EXPECT_NOT to of_unittest_expect
of: prepare to add processing of EXPECT_NOT to of_unittest_expect
of: Use preferred of_property_read_* functions
of: Use of_property_present() helper
of: Add of_property_present() helper
of: reserved_mem: Use proper binary prefix
dt-bindings: Fix multi pattern support in DT_SCHEMA_FILES
of: reserved-mem: print out reserved-mem details during boot
dt-bindings: serial: restrict possible child node names
...
The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the
Qualcomm PMIC Thermal Monitoring ADC. Based on downstream sources, the
new compatible for TM7 differs from older TM5 by allowing configuring
per sensor decimation, time measurement and number of sample averaging -
unlike one configuration per entire device. This was not reflected in
the bindings, therefore comment the new compatible as incomplete as it
might change and its ABI is no stable.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230113090107.18498-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Pull more thermal control updates from Rafael Wysocki:
"These are updates of assorted thermal drivers, mostly for ARM
platforms, generally isolated and fairly straightforward, and the
recent Intel HFI driver fix for systems without HFI support.
Specifics:
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada)
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido
Schimmel)
- Add support for IPQ8074 in the tsens thermal driver along with the
DT bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add HWMon support for the imx8mm board (Alexander Stein)
- Remove pointless include from the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug in the tsens
QCom driver (Manivannan Sadhasivam)
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof)
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn
Andersson)
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König)"
* tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits)
thermal/drivers/imx_sc_thermal: Drop empty platform remove function
thermal/drivers/qcom/lmh: Fix irq handler return value
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
dt-bindings: thermal: k3-j72xx: elaborate on binding description
thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
thermal/drivers/qcom: Demote error log of thermal zone register to debug
thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
thermal/core/power allocator: Remove a useless include
thermal/drivers/imx8mm: Add hwmon support
thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
thermal/drivers/imx: Add support for loading calibration data from OCOTP
...
Only some of TI's J721E SoCs will need a eFuse register range mapped to
determine if they're affected by TI's i2128 erratum. All other SoC will
not need this eFuse range to function properly
Update the bindings for the k3_j72xx_bandgap thermal driver so other
devices will only need two register ranges
Signed-off-by: Bryan Brattlof <bb@ti.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-7-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Document compatible string 'mediatek,mt7986-thermal' for V3 thermal
unit found in MT7986 SoCs.
'mediatek,mt7981-thermal' is also added as it is identical with the
thermal unit of MT7986.
Signed-off-by: Daniel Golle <daniel@makrotopia.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with
calibration values from OCOTP. Document optional phandle to OCOTP nvmem
provider.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Marek Vasut <marex@denx.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Convert the 'generic-adc-thermal' binding to DT schema format.
The binding said '#thermal-sensor-cells' should be 1, but all in tree
users are 0 and 1 doesn't make sense for a single channel.
Drop the example's related providers and consumers of the
'generic-adc-thermal' node as the convention is to not have those in
the examples.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221011175235.3191509-1-robh@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Pull devicetree updates from Rob Herring:
"DT Bindings:
- Various LED binding conversions and clean-ups. Convert the
ir-spi-led, pwm-ir-tx, and gpio-ir-tx LED bindings to schemas.
Consistently reference LED common.yaml or multi-led schemas and
disallow undefined properties.
- Convert IDT 89HPESx, pwm-clock, st,stmipid02, Xilinx PCIe hosts,
and fsl,imx-fb bindings to schema
- Add ata-generic, Broadcom u-boot environment, and dynamic MTD
sub-partitions bindings.
- Make all SPI based displays reference spi-peripheral-props.yaml
- Fix some schema property regex's which should be fixed strings or
were missing start/end anchors
- Remove 'status' in examples, again...
DT Core:
- Fix a possible NULL dereference in overlay functions
- Fix kexec reading 32-bit "linux,initrd-{start,end}" values (which
never worked)
- Add of_address_count() helper to count number of 'reg' entries
- Support .dtso extension for DT overlay source files. Rename staging
and unittest overlay files.
- Update dtc to upstream v1.6.1-63-g55778a03df61"
* tag 'devicetree-for-6.2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (42 commits)
dt-bindings: leds: Add missing references to common LED schema
dt-bindings: leds: intel,lgm: Add missing 'led-gpios' property
of: overlay: fix null pointer dereferencing in find_dup_cset_node_entry() and find_dup_cset_prop()
dt-bindings: lcdif: Fix constraints for imx8mp
media: dt-bindings: atmel,isc: Drop unneeded unevaluatedProperties
dt-bindings: Drop Jee Heng Sia
dt-bindings: thermal: cooling-devices: Add missing cache related properties
dt-bindings: leds: irled: ir-spi-led: convert to DT schema
dt-bindings: leds: irled: pwm-ir-tx: convert to DT schema
dt-bindings: leds: irled: gpio-ir-tx: convert to DT schema
dt-bindings: leds: mt6360: rework to match multi-led
dt-bindings: leds: lp55xx: rework to match multi-led
dt-bindings: leds: lp55xx: switch to preferred 'gpios' suffix
dt-bindings: leds: lp55xx: allow label
dt-bindings: leds: use unevaluatedProperties for common.yaml
dt-bindings: thermal: tsens: Add SM6115 compatible
of/kexec: Fix reading 32-bit "linux,initrd-{start,end}" values
dt-bindings: display: Convert fsl,imx-fb.txt to dt-schema
dt-bindings: Add missing start and/or end of line regex anchors
dt-bindings: qcom,pdc: Add missing compatibles
...
The reference by path (&{/cpus/cpu@101/thermal-idle}) in the example causes
an error with new version of dtc:
FATAL ERROR: Can't generate fixup for reference to path &{/cpus/cpu@100/thermal-idle}
This is because the examples are built as an overlay and absolute paths
are not valid as references must be by label. The path was also not
resolvable because, by default, examples are placed under 'example-N'
nodes.
As the example contains top-level nodes, the root node must be explicit for
the example to be extracted as-is. This changes the indentation for the
whole example, but the existing indentation is a mess of of random amounts.
Clean this up to be 4 spaces everywhere.
Link: https://lore.kernel.org/r/20221111162729.3381835-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
As per the new ADC7 architecture used by the Qualcomm PMICs, each PMIC
has the static Slave ID (SID) assigned by default. The primary PMIC
PMK8350 is responsible for collecting the temperature/voltage data from
the slave PMICs and exposing them via it's registers.
For getting the measurements from the slave PMICs, PMK8350 uses the
channel ID encoded with the SID of the relevant PMIC. So far, the
dt-binding for the slave PMIC PM8350 assumed that there will be only
one PM8350 in a system. So it harcoded SID 1 with channel IDs.
But this got changed in platforms such as Lenovo X13s where there are a
couple of PM8350 PMICs available. So to address multiple PM8350s, change
the binding to accept the SID specified by the user and use it for
encoding the channel ID.
It should be noted that, even though the SID is static it is not
globally unique. Only the primary PMIC has the unique SID id 0.
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20221103095810.64606-2-manivannan.sadhasivam@linaro.org
Pull devicetree updates from Rob Herring:
"DT core:
- Fix node refcounting in of_find_last_cache_level()
- Constify device_node in of_device_compatible_match()
- Fix 'dma-ranges' handling in bus controller nodes
- Fix handling of initrd start > end
- Improve error reporting in of_irq_init()
- Taint kernel on DT unittest running
- Use strscpy instead of strlcpy
- Add a build target, dt_compatible_check, to check for compatible
strings used in kernel sources against compatible strings in DT
schemas.
- Handle DT_SCHEMA_FILES changes when rebuilding
DT bindings:
- LED bindings for MT6370 PMIC
- Convert Mediatek mtk-gce mailbox, MIPS CPU interrupt controller,
mt7621 I2C, virtio,pci-iommu, nxp,tda998x, QCom fastrpc, qcom,pdc,
and arm,versatile-sysreg to DT schema format
- Add nvmem cells to u-boot,env schema
- Add more LED_COLOR_ID definitions
- Require 'opp-table' uses to be a node
- Various schema fixes to match QEMU 'virt' DT usage
- Tree wide dropping of redundant 'Device Tree Binding' in schema
titles
- More (unevaluated|additional)Properties fixes in schema child nodes
- Drop various redundant minItems equal to maxItems"
* tag 'devicetree-for-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (62 commits)
of: base: Shift refcount decrement in of_find_last_cache_level()
dt-bindings: leds: Add MediaTek MT6370 flashlight
dt-bindings: leds: mt6370: Add MediaTek MT6370 current sink type LED indicator
dt-bindings: mailbox: Convert mtk-gce to DT schema
of: base: make of_device_compatible_match() accept const device node
of: Fix "dma-ranges" handling for bus controllers
of: fdt: Remove unused struct fdt_scan_status
dt-bindings: display: st,stm32-dsi: Handle data-lanes in DSI port node
dt-bindings: timer: Add power-domains for TI timer-dm on K3
dt: Add a check for undocumented compatible strings in kernel
kbuild: take into account DT_SCHEMA_FILES changes while checking dtbs
dt-bindings: interrupt-controller: migrate MIPS CPU interrupt controller text bindings to YAML
dt-bindings: i2c: migrate mt7621 text bindings to YAML
dt-bindings: power: gpcv2: correct patternProperties
dt-bindings: virtio: Convert virtio,pci-iommu to DT schema
dt-bindings: timer: arm,arch_timer: Allow dual compatible string
dt-bindings: arm: cpus: Add kryo240 compatible
dt-bindings: display: bridge: nxp,tda998x: Convert to json-schema
dt-bindings: nvmem: u-boot,env: add basic NVMEM cells
dt-bindings: remoteproc: qcom,adsp: enforce smd-edge schema
...
