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1134 Commits

Author SHA1 Message Date
Marco Felsch
6b61aae323 dt-bindings: iio: gyroscope: bosch,bmg160: add spi-max-frequency 
Make use of the common spi-peripheral-props.yaml to pull in the common
spi device properties and limit the spi-max-frequency to 10 MHz as this
is the max. frequency if VDDIO >= 1.62V.

Note all listed devices can either operate in I2C or in SPI mode.

Signed-off-by: Marco Felsch <m.felsch@pengutronix.de>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240221174305.3423039-1-m.felsch@pengutronix.de
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-28 19:26:38 +00:00
Peng Fan
ca1e2b91ba dt-bindings: iio: adc: imx93: drop the 4th interrupt 
Per i.MX93 Reference Mannual Rev.4, 12/2013, there is no interrupt 268,
so drop it.

Signed-off-by: Peng Fan <peng.fan@nxp.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240226130826.3824251-1-peng.fan@oss.nxp.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-28 19:26:38 +00:00
Krzysztof Kozlowski
513ea6b7b4 dt-bindings: iio: adc: drop redundant type from label 
dtschema defines label as string, so $ref in other bindings is
redundant.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240226123004.91061-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-28 19:26:37 +00:00
Marco Felsch
de42d33955 dt-bindings: iio: ti,tmp117: add optional label property 
Add the support to provide an optional label like we do for ADC
channels to identify the device more easily.

Signed-off-by: Marco Felsch <m.felsch@pengutronix.de>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240226121234.545662-1-m.felsch@pengutronix.de
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-28 19:26:37 +00:00
Icenowy Zheng
3b2eaffd2b dt-bindings: iio: magnetometer: Add Voltafield AF8133J 
Voltafield AF8133J is a simple magnetometer sensor produced by Voltafield
Technology Corp, with dual power supplies (one for core and one for I/O)
and active-low reset pin.

The sensor has configurable range 1.2 - 2.2 mT and a software controlled
standby mode.

Add a device tree binding for it.

Signed-off-by: Icenowy Zheng <icenowy@aosc.io>
Signed-off-by: Ondřej Jirman <megi@xff.cz>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240222011341.3232645-3-megi@xff.cz
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-28 19:26:37 +00:00
Javier Carrasco
b8b393348a dt-bindings: iio: light: vishay,veml6075: make vdd-supply required 
The VEML6075 requires a single supply to operate. The property already
exists in the bindings and it is used in the example, but it is still
not on the list of required properties.

Signed-off-by: Javier Carrasco <javier.carrasco.cruz@gmail.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240223-veml6075_vdd-v1-1-ac76509b1998@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-28 19:26:37 +00:00
Marius Cristea
a8ce0b4e56 dt-bindings: iio: adc: adding support for PAC193X 
This is the device tree schema for iio driver for
Microchip PAC193X series of Power Monitors with Accumulator.

Signed-off-by: Marius Cristea <marius.cristea@microchip.com>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240222164206.65700-2-marius.cristea@microchip.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-28 19:26:37 +00:00
Dumitru Ceclan
ff96eb45ba dt-bindings: iio: hmc425a: add entry for LTC6373 
The LTC6373 is a silicon, 3-bit Fully-Differential digital instrumentation
amplifier that supports the following programmable gains (Vout/Vin):
 G = 0.25, 0.5, 1, 2, 4, 8, 16 + Shutdown.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Dumitru Ceclan <mitrutzceclan@gmail.com>
Link: https://lore.kernel.org/r/20240220153553.2432-5-mitrutzceclan@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-28 19:26:36 +00:00
Dumitru Ceclan
5c7403abf9 dt-bindings: iio: hmc425a: add conditional GPIO array size constraints 
ADRF5740 and HMC540S have a 4 bit parallel interface.
Update ctrl-gpios description and min/maxItems values depending on the
matched compatible to correctly reflect the hardware properties.

Fixes: 79f2ff6461 ("dt-bindings: iio: hmc425a: add entry for ADRF5740 Attenuator")
Fixes: 20f87a9a26 ("dt-bindings: iio: hmc425a: add entry for HMC540S")
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Dumitru Ceclan <mitrutzceclan@gmail.com>
Link: https://lore.kernel.org/r/20240220153553.2432-3-mitrutzceclan@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-28 19:26:35 +00:00
Josua Mayer
506d7e3ace dt-bindings: iio: humidity: hdc20x0: add optional interrupts property 
HDC2010 and HDC2080 humidity sensors both have an interrupt / data-ready
signal which can be used for signaling to the host.

Add binding for "interrupts" property so that boards wiring this signal
may describe the connection.

Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Josua Mayer <josua@solid-run.com>
Link: https://lore.kernel.org/r/20240219-iio-hdc20x0-interrupt-binding-v7-1-c8ffb39c3768@solid-run.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-28 19:26:35 +00:00
Thomas Haemmerle
7d87c9b94a dt-bindings: iio: ti,tmp117: add vcc supply binding 
Add the binding to specify the vcc supply. We can't make it required
since this would break the backward compatibility.

Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Thomas Haemmerle <thomas.haemmerle@leica-geosystems.com>
Signed-off-by: Marco Felsch <m.felsch@pengutronix.de>
Link: https://lore.kernel.org/r/20240219131114.134607-1-m.felsch@pengutronix.de
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-28 19:26:35 +00:00
Mike Looijmans
bc4d251ee8 dt-bindings: iio: adc: ti-ads1298: Add bindings 
Bindings for the TI ADS1298 medical ADC. This device is
typically used for ECG and similar measurements. Supports data
acquisition at configurable scale and sampling frequency.

The device has so many options for connecting stuff, at this
point the bindings aren't nearly complete but partial bindings
are better than no bindings at all.

Signed-off-by: Mike Looijmans <mike.looijmans@topic.nl>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240216153020.485201-1-mike.looijmans@topic.nl
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-19 19:32:22 +00:00
Petre Rodan
158b48c864 dt-bindings: iio: pressure: honeywell,hsc030pa.yaml add spi props 
Add spi-peripheral-props.yaml requirement needed by the
spi-max-frequency property.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Petre Rodan <petre.rodan@subdimension.ro>
Link: https://lore.kernel.org/r/20240211075645.28777-2-petre.rodan@subdimension.ro
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-19 19:32:22 +00:00
Nuno Sa
a032b921bd dt-bindings: adc: axi-adc: update bindings for backend framework 
'adi,adc-dev' is now deprecated and must not be used anymore. Hence,
also remove it from being required.

The reason why it's being deprecated is because the axi-adc CORE is now
an IIO service provider hardware (IIO backends) for consumers to make use
of. Before, the logic with 'adi,adc-dev' was the opposite (it was kind
of consumer referencing other nodes/devices) and that proved to be wrong
and to not scale.

Now, IIO consumers of this hardware are expected to reference it using the
io-backends property. Hence, the new '#io-backend-cells' is being added
so the device is easily identified as a provider.

Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Nuno Sa <nuno.sa@analog.com>
Link: https://lore.kernel.org/r/20240210-iio-backend-v11-2-f5242a5fb42a@analog.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-19 19:32:21 +00:00
Nuno Sa
49bb3839e0 dt-bindings: adc: ad9467: add new io-backend property 
The ad9467 will make use of the new IIO backend framework which is a
provider - consumer interface where IIO backends provide services to
consumers. As such, and being this device a consumer,  add the new
generic io-backend property to the bindings.

Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Nuno Sa <nuno.sa@analog.com>
Link: https://lore.kernel.org/r/20240210-iio-backend-v11-1-f5242a5fb42a@analog.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-19 19:32:21 +00:00
Dimitri Fedrau
9f9bfae410 dt-bindings: iio: humidity: hdc3020: add interrupt bindings in example 
Add interrupt bindings in example.

Signed-off-by: Dimitri Fedrau <dima.fedrau@gmail.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20240214085350.19382-3-dima.fedrau@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-17 16:16:12 +00:00
Naresh Solanki
f1f99fcbf9 dt-bindings: iio: afe: voltage-divider: Add io-channel-cells 
Enable the voltage divider to both receive and provide measurement
services by adding #io-channel-cells.

This is especially valuable in scenarios where an ADC has an analog
frontend, like a voltage divider, and obtaining its raw value isn't
interesting. It is desired to get the real voltage before the voltage
divider.

Signed-off-by: Naresh Solanki <naresh.solanki@9elements.com>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240206105502.648255-1-naresh.solanki@9elements.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-17 16:16:12 +00:00
Lorenzo Bianconi
7c28226cd0 dt-bindings: iio: imu: st_lsm6dsx: add asm330lhhxg1 
Add device bindings for asm330lhhxg1 IMU sensor.
The lsm6dsr supports the features and functionality provided by
the asm330lhhxg1 via identical interfaces and so is a suitable
fallback compatible.

Signed-off-by: Lorenzo Bianconi <lorenzo@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/942452ec9626bc1166501cec0fa88c369e28ec6f.1706961432.git.lorenzo@kernel.org
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-17 16:16:11 +00:00
Kim Seer Paller
7b5f651127 dt-bindings: iio: frequency: add admfm2000 
Dual microwave down converter module with input RF and LO frequency
ranges from 0.5 to 32 GHz and an output IF frequency range from 0.1 to
8 GHz. It consists of a LNA, mixer, IF filter, DSA, and IF amplifier
for each down conversion path.

Signed-off-by: Kim Seer Paller <kimseer.paller@analog.com>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240123081059.5746-1-kimseer.paller@analog.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-02-17 16:16:10 +00:00
ChiYuan Huang
41b5684e58 dt-bindings: iio: adc: rtq6056: add support for the whole RTQ6056 family 
Add compatible support for RTQ6053 and RTQ6059.

Signed-off-by: ChiYuan Huang <cy_huang@richtek.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/c1abb261bb00846f456eb8fe9b5919f59f287c24.1704676198.git.cy_huang@richtek.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-01-23 22:06:56 +00:00
Petre Rodan
f088491661 dt-bindings: iio: pressure: honeywell,mprls0025pa.yaml add spi bus 
Add spi based example.

Add spi-max-frequency property required by chip specifications.

Add additional maintainer.

Co-developed-by: Andreas Klinger <ak@it-klinger.de>
Signed-off-by: Andreas Klinger <ak@it-klinger.de>
Signed-off-by: Petre Rodan <petre.rodan@subdimension.ro>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231229092445.30180-4-petre.rodan@subdimension.ro
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-01-22 19:23:32 +00:00
Petre Rodan
0181749d4e dt-bindings: iio: pressure: honeywell,mprls0025pa.yaml add pressure-triplet 
Change order of properties in order for the end user to hopefully ignore
pmin-pascal and pmax-pascal which are superseded by pressure-triplet.

Add pressure-triplet property which automatically initializes
pmin-pascal and pmax-pascal inside the driver.

Rework honeywell,pmXX-pascal requirements based on feedback from
Jonathan and Conor.

Co-developed-by: Andreas Klinger <ak@it-klinger.de>
Signed-off-by: Andreas Klinger <ak@it-klinger.de>
Signed-off-by: Petre Rodan <petre.rodan@subdimension.ro>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231229092445.30180-3-petre.rodan@subdimension.ro
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-01-22 19:23:32 +00:00
Petre Rodan
7b34e1e330 dt-bindings: iio: pressure: honeywell,mprls0025pa.yaml improvements 
Define enum inside the honeywell,transfer-function property block.

Set the correct irq edge in the example block.
Based on the datasheet, in table 13 on page 11:
"End-of-conversion indicator: This pin is set high when a measurement
and calculation have been completed and the data is ready to be
clocked out"

Add description on End-of-conversion interrupt.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Co-developed-by: Andreas Klinger <ak@it-klinger.de>
Signed-off-by: Andreas Klinger <ak@it-klinger.de>
Signed-off-by: Petre Rodan <petre.rodan@subdimension.ro>
Link: https://lore.kernel.org/r/20231229092445.30180-2-petre.rodan@subdimension.ro
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-01-22 19:23:32 +00:00
Javier Carrasco
b4d9716564 dt-bindings: iio: light: as73211: add support for as7331 
This device has the same properties and I2C addresses as the as73211.
The only difference between them is the photodiodes they use internally,
which in this case is irrelevant for the bindings.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Javier Carrasco <javier.carrasco.cruz@gmail.com>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2024-01-22 18:58:44 +00:00
Linus Torvalds
296455ade1 Merge tag 'char-misc-6.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc 
Pull char/misc and other driver updates from Greg KH:
 "Here is the big set of char/misc and other driver subsystem changes
  for 6.8-rc1.

  Other than lots of binder driver changes (as you can see by the merge
  conflicts) included in here are:

   - lots of iio driver updates and additions

   - spmi driver updates

   - eeprom driver updates

   - firmware driver updates

   - ocxl driver updates

   - mhi driver updates

   - w1 driver updates

   - nvmem driver updates

   - coresight driver updates

   - platform driver remove callback api changes

   - tags.sh script updates

   - bus_type constant marking cleanups

   - lots of other small driver updates

  All of these have been in linux-next for a while with no reported
  issues"

* tag 'char-misc-6.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (341 commits)
  android: removed duplicate linux/errno
  uio: Fix use-after-free in uio_open
  drivers: soc: xilinx: add check for platform
  firmware: xilinx: Export function to use in other module
  scripts/tags.sh: remove find_sources
  scripts/tags.sh: use -n to test archinclude
  scripts/tags.sh: add local annotation
  scripts/tags.sh: use more portable -path instead of -wholename
  scripts/tags.sh: Update comment (addition of gtags)
  firmware: zynqmp: Convert to platform remove callback returning void
  firmware: turris-mox-rwtm: Convert to platform remove callback returning void
  firmware: stratix10-svc: Convert to platform remove callback returning void
  firmware: stratix10-rsu: Convert to platform remove callback returning void
  firmware: raspberrypi: Convert to platform remove callback returning void
  firmware: qemu_fw_cfg: Convert to platform remove callback returning void
  firmware: mtk-adsp-ipc: Convert to platform remove callback returning void
  firmware: imx-dsp: Convert to platform remove callback returning void
  firmware: coreboot_table: Convert to platform remove callback returning void
  firmware: arm_scpi: Convert to platform remove callback returning void
  firmware: arm_scmi: Convert to platform remove callback returning void
  ...
 2024-01-17 16:47:17 -08:00
Linus Torvalds
38814330fe Merge tag 'devicetree-for-6.8' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux 
Pull devicetree updates from Rob Herring:

 - Convert FPGA bridge, all TPMs (finally), and Rockchip HDMI bindings
   to schemas

 - Improvements in Samsung GPU schemas

 - A few more cases of dropping unneeded quotes in schemas

 - Merge QCom idle-states txt binding into common idle-states schema

 - Add X1E80100, SM8650, SM8650, and SDX75 SoCs to QCom Power Domain
   Controller

 - Add NXP i.mx8dl to SCU PD

 - Add synaptics r63353 panel controller

 - Clarify the wording around the use of 'wakeup-source' property

 - Add a DTS coding style doc

 - Add smi vendor prefix

 - Fix DT_SCHEMA_FILES incorrect matching of paths outside the kernel
   tree

 - Disable sysfb (e.g. EFI FB) when simple-framebuffer node is present

 - Fix double free in of_parse_phandle_with_args_map()

 - A couple of kerneldoc fixes

* tag 'devicetree-for-6.8' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (37 commits)
  of: unittest: Fix of_count_phandle_with_args() expected value message
  dt-bindings: fpga: altera: Convert bridge bindings to yaml
  dt-bindings: fpga: Convert bridge binding to yaml
  dt-bindings: vendor-prefixes: Add smi
  dt-bindings: power: Clarify wording for wakeup-source property
  of: Fix double free in of_parse_phandle_with_args_map
  dt-bindings: ignore paths outside kernel for DT_SCHEMA_FILES
  drivers: of: Fixed kernel doc warning
  dt-bindings: tpm: Document Microsoft fTPM bindings
  dt-bindings: tpm: Convert IBM vTPM bindings to DT schema
  dt-bindings: tpm: Convert Google Cr50 bindings to DT schema
  dt-bindings: tpm: Consolidate TCG TIS bindings
  dt-bindings: display: rockchip,inno-hdmi: Document RK3128 compatible
  dt-bindings: arm: Add remote etm dt-binding
  dt-bindings: mmc: sdhci-pxa: Fix 'regs' typo
  media: dt-bindings: samsung,s5p-mfc: Fix iommu properties schemas
  dt-bindings: display: panel: Add synaptics r63353 panel controller
  dt-bindings: arm: merge qcom,idle-state with idle-state
  dt-bindings: drm: rockchip: convert inno_hdmi-rockchip.txt to yaml
  dt-bindings: cache: qcom,llcc: correct QDU1000 reg entries
  ...
 2024-01-12 15:05:30 -08:00
Marcelo Schmitt
6875b85729 dt-bindings: iio: Add AD7091R-8 
Add device tree documentation for AD7091R-8.

Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Marcelo Schmitt <marcelo.schmitt@analog.com>
Link: https://lore.kernel.org/r/632eb34801ae54feda453b6a65d60fc8ac2891fd.1703013352.git.marcelo.schmitt1@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-26 15:43:10 +00:00
Anshul Dalal
6b626eee66 dt-bindings: iio: dac: add MCP4821 
Adds support for MCP48xx series of DACs.

Datasheet: https://ww1.microchip.com/downloads/en/DeviceDoc/22244B.pdf #MCP48x1
Datasheet: https://ww1.microchip.com/downloads/en/DeviceDoc/20002249B.pdf #MCP48x2
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Anshul Dalal <anshulusr@gmail.com>
Link: https://lore.kernel.org/r/20231220151954.154595-1-anshulusr@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-21 17:01:29 +00:00
Anshul Dalal
c9c6f564b2 dt-bindings: iio: chemical: add aosong,ags02ma 
Add bindings for Aosong AGS02MA TVOC sensor.

The sensor communicates over i2c with the default address 0x1a.
TVOC values can be read in the units of ppb and ug/m^3 at register 0x00.

Datasheet: https://asairsensors.com/wp-content/uploads/2021/09/AGS02MA.pdf
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Anshul Dalal <anshulusr@gmail.com>
Link: https://lore.kernel.org/r/20231215162312.143568-2-anshulusr@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-17 14:43:59 +00:00
Li peiyu
693af17bce dt-bindings: iio: humidity: Add TI HDC302x support 
Add device tree bindings for HDC3020/HDC3021/HDC3022 humidity and
temperature sensors.

Signed-off-by: Li peiyu <579lpy@gmail.com>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20231211123101.9868-1-579lpy@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-11 19:38:37 +00:00
Anshul Dalal
48ba7d2f24 dt-bindings: iio: light: add ltr390 
Add binding for Lite-On LTR390 which is an Ambient/UV light sensor that
communicates over i2c with an address of 0x53.

Datasheet: https://optoelectronics.liteon.com/upload/download/DS86-2015-0004/LTR-390UV_Final_%20DS_V1%201.pdf
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Anshul Dalal <anshulusr@gmail.com>
Link: https://lore.kernel.org/r/20231208102211.413019-1-anshulusr@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-11 19:16:35 +00:00
Petre Rodan
5fc0a980cc dt-bindings: iio: pressure: add honeywell,hsc030 
Adds binding for digital Honeywell TruStability HSC and SSC series
pressure and temperature sensors.
Communication is one way. The sensor only requires 4 bytes worth of
clock pulses on both i2c and spi in order to push the data out.
The i2c address is hardcoded and depends on the part number.
There is no additional GPIO control.
driver is based on iio/togreg

Datasheet:
https://prod-edam.honeywell.com/content/dam/honeywell-edam/sps/siot/en-us/products/sensors/pressure-sensors/board-mount-pressure-sensors/trustability-hsc-series/documents/sps-siot-trustability-hsc-series-high-accuracy-board-mount-pressure-sensors-50099148-a-en-ciid-151133.pdf [HSC]
Datasheet:
https://prod-edam.honeywell.com/content/dam/honeywell-edam/sps/siot/en-us/products/sensors/pressure-sensors/board-mount-pressure-sensors/trustability-ssc-series/documents/sps-siot-trustability-ssc-series-standard-accuracy-board-mount-pressure-sensors-50099533-a-en-ciid-151134.pdf [SSC]

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Petre Rodan <petre.rodan@subdimension.ro>
Link: https://lore.kernel.org/r/20231207164634.11998-1-petre.rodan@subdimension.ro
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-11 19:16:34 +00:00
Crt Mori
464cb18758 dt-bindings: iio: temperature: add MLX90635 device 
Add device tree bindings for MLX90635 Infra Red contactless temperature
sensor.

Signed-off-by: Crt Mori <cmo@melexis.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/0313c3b9f7490c32891627feb5ef35d5e5d9aae9.1701872051.git.cmo@melexis.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-11 19:16:34 +00:00
Johan Hovold
90ae7ed9ba dt-bindings: iio/adc: qcom,spmi-vadc: clean up examples 
Clean up the VADC examples by dropping a comment, dropping unnecessary
labels and adding newline separators.

Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20231130171628.12257-7-johan+linaro@kernel.org
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-06 17:19:52 +00:00
Johan Hovold
482aa83e3d dt-bindings: iio/adc: qcom,spmi-vadc: fix example node names 
The VADC is a child of an SPMI PMIC, which in turn sits on an SPMI bus.

Fixes: 74e903461b ("dt-bindings: iio: adc: qcom,spmi-vadc: extend example")
Fixes: 5a471662b5 ("iio: adc: Convert the QCOM SPMI ADC bindings to .yaml format")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20231130171628.12257-6-johan+linaro@kernel.org
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-06 17:19:52 +00:00
Johan Hovold
adb2af792b dt-bindings: iio/adc: qcom,spmi-rradc: clean up example 
Clean up the RRADC example by dropping an unnecessary label and removing
stray white space.

Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20231130171628.12257-5-johan+linaro@kernel.org
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-06 17:19:52 +00:00
Johan Hovold
9b2b96a0f9 dt-bindings: iio/adc: qcom,spmi-iadc: clean up example 
Clean up the IADC example by adding a newline separator, dropping an
unnecessary label and removing stray white space.

Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20231130171628.12257-4-johan+linaro@kernel.org
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-06 17:19:52 +00:00
Johan Hovold
9751b00dbf dt-bindings: iio/adc: qcom,spmi-iadc: fix example node name 
The IADC is a child of an SPMI PMIC, which in turn sits on an SPMI bus.

Fixes: a4e6bf6941 ("dt-bindings:iio:adc:qcom,spmi-iadc: txt to yaml format conversion.")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20231130171628.12257-3-johan+linaro@kernel.org
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-06 17:19:52 +00:00
Johan Hovold
a163854af7 dt-bindings: iio/adc: qcom,spmi-iadc: fix reg description 
The IADC register is just the base address in the SPMI PMIC and does not
include any length.

Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20231130171628.12257-2-johan+linaro@kernel.org
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-06 17:19:52 +00:00
Javier Carrasco
249f27ac71 dt-bindings: iio: light: add support for Vishay VEML6075 
The Vishay VEML6075 is a 16-bit digital UVA and UVB sensor with I2C
interface.

Add bindings and an example for the Vishay VEML6075.

Signed-off-by: Javier Carrasco <javier.carrasco.cruz@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231110-veml6075-v3-2-6ee46775b422@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-04 13:57:24 +00:00
Rob Herring
a61b9a40d6 dt-bindings: iio/adc: ti,palmas-gpadc: Drop incomplete example 
The example for the TI Palmas ADC is incomplete as the binding is the
full PMIC, not just the sub-functions. It is preferred for MFD examples
to be complete in the top-level MFD device binding rather than piecemeal
in each sub-function binding.

This also fixes an undocumented (by schema) compatible warning for
'"ti,twl6035-pmic", "ti,palmas-pmic"'.

Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231128214803.3975542-1-robh@kernel.org
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-04 13:23:05 +00:00
Michael Hennerich
d49f69425d dt-bindings: adi,ad5791: Add support for controlling RBUF 
Added new property to support an external amplifier to be connected in a
gain of two configuration.

Signed-off-by: Michael Hennerich <michael.hennerich@analog.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Nuno Sa <nuno.sa@analog.com>
Link: https://lore.kernel.org/r/20231129-ad5791-michael-stuff-v3-1-48e192b00909@analog.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-04 13:19:48 +00:00
Krzysztof Kozlowski
f2dd716cb4 dt-bindings: iio: honeywell,mprls0025pa: drop ref from pressure properties 
The dtschema treats now properties with '-pascal' suffix as standard one
and already defines $ref for them, thus the $ref should be dropped from
the bindings.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20231129111041.26782-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-12-04 12:18:58 +00:00
Krzysztof Kozlowski
e185a24eea dt-bindings: correct white-spaces in examples 
Use only one and exactly one space around '=' in DTS example.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Serge Semin <fancer.lancer@gmail.com>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # For MMC
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for-iio
Acked-by: Stephen Boyd <sboyd@kernel.org>
Link: https://lore.kernel.org/r/20231124092121.16866-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring <robh@kernel.org>
 2023-11-29 14:32:08 -06:00
Ana-Maria Cusco
79f2ff6461 dt-bindings: iio: hmc425a: add entry for ADRF5740 Attenuator 
The ADRF5740 is a silicon, 4-bit digital attenuator with 22 dB
attenuation control range in 2 dB steps.

Signed-off-by: Ana-Maria Cusco <ana-maria.cusco@analog.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20231113102535.51074-3-anamaria.cuscoo@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-11-26 16:36:35 +00:00
Ramona Gradinariu
e4cfeca8f8 dt-bindings: adis16460: Add 'spi-cs-inactive-delay-ns' property 
The adis16460 device requires a stall time between SPI
transactions (during which the chip select is inactive),
with a minimum value equal to 16 microseconds.
This commit adds 'spi-cs-inactive-delay-ns' property, which should
indicate the stall time between consecutive SPI transactions.
The specified minimum time may not be sufficient for all
configurations.

Signed-off-by: Ramona Gradinariu <ramona.gradinariu@analog.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231027140358.328699-4-ramona.gradinariu@analog.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-11-16 19:10:28 +00:00
Ramona Gradinariu
215960408d dt-bindings: adis16475: Add 'spi-cs-inactive-delay-ns' property 
The devices supported by adis16475 driver require a stall period
between SPI transactions (during which the chip select is
inactive), with a minimum value equal to 16 microseconds, thus
adding 'spi-cs-inactive-delay-ns' property, which should indicate
the stall time between consecutive SPI transactions.
The specified minimum time may not be sufficient for all
configurations.

Signed-off-by: Ramona Gradinariu <ramona.gradinariu@analog.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231027140358.328699-3-ramona.gradinariu@analog.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-11-16 19:10:28 +00:00
Andrew Hepp
d6f250b1fe dt-bindings: iio: Add MCP9600 thermocouple EMF converter 
Add support for the MCP9600 thermocouple electromotive force converter. The sensor has  integrated cold junction compensation and a typical accuracy of 0.5 degrees Celsius. The driver supports a resolution of 0.0625 degrees Celsius.

Datasheet: https://ww1.microchip.com/downloads/en/DeviceDoc/MCP960X-Data-Sheet-20005426.pdf
Signed-off-by: Andrew Hepp <andrew.hepp@ahepp.dev>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231025233153.5454-1-andrew.hepp@ahepp.dev
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-11-16 19:10:28 +00:00
Jagath Jog J
a0357c08d4 dt-bindings: iio: imu: Add Bosch BMI323 
Add devicetree description document for Bosch BMI323, a 6-Axis IMU.

Signed-off-by: Jagath Jog J <jagathjog1996@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231013034808.8948-2-jagathjog1996@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-11-16 19:10:25 +00:00
Ivan Mikhaylov
f0d1a9b7a0 dt-bindings: adc: provide max34408/9 device tree binding document 
The hardware binding for i2c current monitoring device with overcurrent
control.

Signed-off-by: Ivan Mikhaylov <fr0st61te@gmail.com>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20231014211254.16719-2-fr0st61te@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
 2023-11-16 19:10:25 +00:00