Both 1 and 2 are valid values for #address-cells and #size-cells on the
various busses specified in these bindings, so explicitly allow 2.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
This patch adds YAML schema for DT bindings of Output Processing
Engine (OPE) module. It consists of Parametric Equalizer (PEQ)
and Multi Band Dynamic Range Compressor (MBDRC) sub blocks and
binding doc for these blocks are added as well. The OPE will be
registered as an ASoC component and can be plugged into an audio
path as per need via ALSA mixer controls. The DT bindings are
applicable on Tegra210 and later SoCs where OPE module is present.
Signed-off-by: Sameer Pujar <spujar@nvidia.com>
Link: https://lore.kernel.org/r/1654238172-16293-2-git-send-email-spujar@nvidia.com
Signed-off-by: Mark Brown <broonie@kernel.org>
This patch adds YAML schema for DT bindings of Asynchronous Sample Rate
Converter (ASRC) module. It will be registered as an ASoC component and
can be plugged into an audio path as per need via ALSA mixer controls.
The bindings are applicable on Tegra186 and later where the ASRC device
is present.
Signed-off-by: Sameer Pujar <spujar@nvidia.com>
Link: https://lore.kernel.org/r/1648735412-32220-2-git-send-email-spujar@nvidia.com
Signed-off-by: Mark Brown <broonie@kernel.org>
This patch adds YAML schema for DT bindings of few AHUB modules.
These devices will be registered as ASoC components and bindings
will be used on Tegra210 and later chips. The bindings for below
mentioned modules are added:
* SFC (Sampling Frequency Converter)
* MVC (Master Volume Control)
* AMX (Audio Multiplexer)
* ADX (Audio Demultiplexer)
* Mixer
Signed-off-by: Sameer Pujar <spujar@nvidia.com>
Cc: Rob Herring <robh+dt@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1631551342-25469-5-git-send-email-spujar@nvidia.com
Signed-off-by: Mark Brown <broonie@kernel.org>
This patch adds YAML schema for DT binding of AHUB and few of its
following components. These devices will be registered as ASoC
components and binding will be used on Tegra210 and later chips.
* ADMAIF
* I2S
* DMIC
* DSPK
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Signed-off-by: Sameer Pujar <spujar@nvidia.com>
Link: https://lore.kernel.org/r/1595134890-16470-2-git-send-email-spujar@nvidia.com
Signed-off-by: Mark Brown <broonie@kernel.org>
