Commit Graph

194 Commits

Author SHA1 Message Date
Linus Torvalds
83bd89291f Merge tag 'char-misc-6.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc
Pull char/misc/IIO driver updates from Greg KH:
 "Here is the big set of char/misc/iio driver updates for 6.19-rc1. Lots
  of stuff in here including:

   - lots of IIO driver updates, cleanups, and additions

   - large interconnect driver changes as they get converted over to a
     dynamic system of ids

   - coresight driver updates

   - mwave driver updates

   - binder driver updates and changes

   - comedi driver fixes now that the fuzzers are being set loose on
     them

   - nvmem driver updates

   - new uio driver addition

   - lots of other small char/misc driver updates, full details in the
     shortlog

  All of these have been in linux-next for a while now"

* tag 'char-misc-6.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (304 commits)
  char: applicom: fix NULL pointer dereference in ac_ioctl
  hangcheck-timer: fix coding style spacing
  hangcheck-timer: Replace %Ld with %lld
  hangcheck-timer: replace printk(KERN_CRIT) with pr_crit
  uio: Add SVA support for PCI devices via uio_pci_generic_sva.c
  dt-bindings: slimbus: fix warning from example
  intel_th: Fix error handling in intel_th_output_open
  misc: rp1: Fix an error handling path in rp1_probe()
  char: xillybus: add WQ_UNBOUND to alloc_workqueue users
  misc: bh1770glc: use pm_runtime_resume_and_get() in power_state_store
  misc: cb710: Fix a NULL vs IS_ERR() check in probe()
  mux: mmio: Add suspend and resume support
  virt: acrn: split acrn_mmio_dev_res out of acrn_mmiodev
  greybus: gb-beagleplay: Fix timeout handling in bootloader functions
  greybus: add WQ_PERCPU to alloc_workqueue users
  char/mwave: drop typedefs
  char/mwave: drop printk wrapper
  char/mwave: remove printk tracing
  char/mwave: remove unneeded fops
  char/mwave: remove MWAVE_FUTZ_WITH_OTHER_DEVICES ifdeffery
  ...
2025-12-06 18:34:24 -08:00
Luca Weiss
dfb1717308 dt-bindings: interconnect: qcom,sm6350-rpmh: Add clocks for QoS
Add the clocks for some interconnects to the bindings that are required
to set up the QoS correctly. Update one of the examples to aggre2_noc to
have an example with clocks.

Also while we're at it, remove #interconnect-cells: true as that's
already provided from qcom,rpmh-common.yaml.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Link: https://lore.kernel.org/r/20251114-sm6350-icc-qos-v2-1-6af348cb9c69@fairphone.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-11-19 16:03:00 +02:00
Georgi Djakov
d32e1c2dcc Merge branch 'icc-kaanapali' into icc-next
Add interconnect dt-bindings and driver support for Qualcomm Kaanapali SoC.

* icc-kaanapali
  dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in Kaanapali SoC
  interconnect: qcom: add Kaanapali interconnect provider driver
  dt-bindings: interconnect: qcom-bwmon: Document Kaanapali BWMONs

Link: https://lore.kernel.org/r/20251031-knp-interconnect-v4-0-568bba2cb3e5@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-11-19 01:24:58 +02:00
Amir Vajid
6e38a225fc dt-bindings: interconnect: qcom-bwmon: Document Kaanapali BWMONs
Document the Kaanapali BWMONs, which have one instance per
cluster of BWMONv4.

Signed-off-by: Amir Vajid <amir.vajid@oss.qualcomm.com>
Signed-off-by: Jingyi Wang <jingyi.wang@oss.qualcomm.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250924-knp-bwmon-v1-1-56a9cdda7d72@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-11-19 01:22:33 +02:00
Rob Herring (Arm)
0b2333183a dt-bindings: Remove extra blank lines
Generally at most 1 blank line is the standard style for DT schema
files. Remove the few cases with more than 1 so that the yamllint check
for this can be enabled.

Acked-by: Lee Jones <lee@kernel.org>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org> # remoteproc
Acked-by: Georgi Djakov <djakov@kernel.org>
Acked-by: Vinod Koul <vkoul@kernel.org>
Acked-by: Andi Shyti <andi.shyti@kernel.org>
Acked-by: Bartosz Golaszewski <bartosz.golaszewski@linaro.org>
Acked-by: Jonathan Cameron <jonathan.cameron@huawei.com>
Acked-by: Philipp Zabel <p.zabel@pengutronix.de>
Acked-by: Uwe Kleine-König <ukleinek@kernel.org> # for allwinner,sun4i-a10-pwm.yaml
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # mtd
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Acked-by: Manivannan Sadhasivam <mani@kernel.org> # For PCI controller bindings
Link: https://patch.msgid.link/20251023143957.2899600-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2025-11-17 11:24:50 -06:00
Krzysztof Kozlowski
bcc357c8e0 dt-bindings: Update Krzysztof Kozlowski's email
Update Krzysztof Kozlowski's email address to kernel.org account to stay
reachable.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251021095354.86455-2-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2025-11-17 11:24:50 -06:00
Raviteja Laggyshetty
7463f5ad36 dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in Kaanapali SoC
Document the RPMh Network-On-Chip Interconnect of the Kaanapali platform.

Co-developed-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com>
Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com>
Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20251031-knp-interconnect-v4-1-568bba2cb3e5@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-10-31 16:04:04 +02:00
Odelu Kukatla
8a55fbe4c9 dt-bindings: interconnect: add reg and clocks properties to enable QoS on sa8775p
Add 'reg' and 'clocks' properties to enable QoS configuration. These
properties enable access to QoS registers and necessary clocks for
configuration.

QoS configuration is essential for ensuring that latency sensitive
components such as CPUs and multimedia engines receive prioritized
access to memory and interconnect resources. This helps to manage
bandwidth and latency across subsystems, improving system responsiveness
and performance in concurrent workloads.

Both 'reg' and 'clocks' properties are optional. If either is missing,
QoS configuration will be skipped. This behavior is controlled by the
'qos_requires_clocks' flag in the driver, which ensures that QoS
configuration is bypassed when required clocks are not defined.

Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20251001073344.6599-2-odelu.kukatla@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-10-31 02:35:22 +02:00
Georgi Djakov
bcdf7a064c Merge branch 'icc-glymur' into icc-next
Add interconnect dt-bindings and driver support for
Qualcomm's next gen compute SoC - Glymur.

* icc-glymur
  dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in Glymur SoC
  interconnect: qcom: icc-rpmh: increase MAX_PORTS to support four QoS ports
  interconnect: qcom: add glymur interconnect provider driver

Link: https://lore.kernel.org/r/20250814-glymur-icc-v2-0-596cca6b6015@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-09-12 13:54:17 +03:00
Raviteja Laggyshetty
273532a0da dt-bindings: interconnect: Add OSM L3 compatible for QCS615 SoC
Add Operation State Manager (OSM) L3 interconnect provider binding for
QCS615 SoC. As the OSM hardware in QCS615 and SM8150 are same,
added a family-level compatible for SM8150 SoC.

Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250819-talos-l3-icc-v3-1-04529e85dac7@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-09-12 13:53:43 +03:00
Raviteja Laggyshetty
7fdc1d1b02 dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in Glymur SoC
Document the RPMh Network-On-Chip Interconnect in Glymur platform.

Co-developed-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com>
Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com>
Reviewed-by: "Rob Herring (Arm)" <robh@kernel.org>
Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250814-glymur-icc-v2-1-596cca6b6015@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-08-15 00:30:47 +03:00
Linus Torvalds
115e74a29b Merge tag 'soc-dt-6.17' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull SoC devicetree updates from Arnd Bergmann:
 "There are a few new variants of existing chips:

   - mt6572 is an older mobile phone chip from mediatek that was
     extremely popular a decade ago but never got upstreamed until now

   - exynos2200 is a recent high-end mobile phone chip used in a few
     Samsung phones like the Galaxy S22

   - Renesas R-Car V4M-7 (R8A779H2) is an updated version of R-Car V4M
     (R8A779H0) and used in automotive applications

   - Tegra264 is a new chip from NVIDIA, but support is fairly minimal
     for now, and not much information is public about it

  There are five more chips in a separate branch, as those are new chip
  families that I merged along with the necessary infrastructure.

  New board support is not that exciting, with a total of 33 newly added
  machines here:

   - Evaluation platforms for the chips above, plus TI am62d2 and Sophgo
     sg2042

   - Six 32-bit industrial boards based on stm32, imx6 and am33 chips,
     plus eight 64-bit rockchips rk33xx/rk35xx, am62d2, t527, imx8 and
     imx95

   - Two newly added ASPEED BMC based motherboards, and one that got
     removed

   - Phones and Tablets based on 32-bit mt6572, tegra30 and 64-bit
     msm8976 SoCs

   - Three Laptops based on Mediatek mt8186 and Qualcomm Snapdragon X1

   - A set-top box based on Amlogic meson-gxm

  Updates for existing machines are spread over all the above families.
  One notable change here is support for the RP1 I/O chip used in
  Raspberry Pi 5"

* tag 'soc-dt-6.17' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (606 commits)
  riscv: dts: sophgo: fix mdio node name for CV180X
  riscv: dts: sophgo: sophgo-srd3-10: reserve uart0 device
  riscv: dts: sophgo: add Sophgo SG2042_EVB_V2.0 board device tree
  riscv: dts: sophgo: add Sophgo SG2042_EVB_V1.X board device tree
  dt-bindings: riscv: add Sophgo SG2042_EVB_V1.X/V2.0 bindings
  riscv: dts: sophgo: add ethernet GMAC device for sg2042
  riscv: dts: sophgo: Enable ethernet device for Huashan Pi
  riscv: dts: sophgo: Add mdio multiplexer device for cv18xx
  riscv: dts: sophgo: Add ethernet device for cv18xx
  riscv: dts: sophgo: sg2044: add pmu configuration
  riscv: dts: sophgo: sg2044: add ziccrse extension
  riscv: dts: sophgo: add zfh for sg2042
  riscv: dts: sophgo: add ziccrse for sg2042
  riscv: dts: sophgo: Add xtheadvector to the sg2042 devicetree
  riscv: dts: sophgo: sg2044: add PCIe device support for SG2044
  riscv: dts: sophgo: sg2044: add MSI device support for SG2044
  riscv: dts: sophgo: add reset configuration for Sophgo CV1800 series SoC
  riscv: dts: sophgo: add reset generator for Sophgo CV1800 series SoC
  dt-bindings: soc: sophgo: Move SoCs/boards from riscv into soc, add SG2000
  riscv: dts: sophgo: sg2044: Add missing riscv,cbop-block-size property
  ...
2025-07-29 11:04:52 -07:00
Georgi Djakov
ca652cf0c2 Merge branch 'icc-milos' into icc-next
Add documentation and driver for the interconnect on the Milos SoC.

* icc-milos
  dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in Qualcomm Milos SoC
  interconnect: qcom: Add Milos interconnect provider driver

Link: https://lore.kernel.org/r/20250709-sm7635-icc-v3-0-c446203c3b3a@fairphone.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-22 14:41:12 +03:00
Luca Weiss
0f29e33fba dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in Qualcomm Milos SoC
Document the RPMh Network-On-Chip Interconnect of the Milos (e.g.
SM7635) SoC.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Link: https://lore.kernel.org/r/20250709-sm7635-icc-v3-1-c446203c3b3a@fairphone.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-21 19:41:07 +03:00
Konrad Dybcio
a234cffd04 dt-bindings: interconnect: qcom,msm8998-bwmon: Allow 'nonposted-mmio'
One of the BWMON instances on SM8750 requires that its MMIO space is
mapped specifically with the nE memory attribute.

Allow the nonposted-mmio property which instructs the OS to do so.

Signed-off-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250716-8750_cpubwmon-v4-1-12212098e90f@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18 17:54:58 +03:00
Raviteja Laggyshetty
a95571d8ff dt-bindings: interconnect: Add EPSS L3 compatible for QCS8300 SoC
Add Epoch Subsystem (EPSS) L3 interconnect provider binding for
QCS8300 SoC. As the EPSS hardware in QCS8300 and SA8775P are same,
added a family-level compatible for SA877P SoC. This shared fallback
compatible allows grouping of SoCs with similar hardware, reducing
the need to explicitly list each variant in the driver match table.

Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250711102540.143-2-raviteja.laggyshetty@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18 17:54:58 +03:00
Luca Weiss
a8d7161d1d dt-bindings: interconnect: qcom: Remove double colon from description
No double colon is necessary in the description. Fix it for all bindings
so future bindings won't have the same copy-paste mistake.

Reported-by: Rob Herring <robh@kernel.org>
Closes: https://lore.kernel.org/lkml/20250625150458.GA1182597-robh@kernel.org/
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250717-bindings-double-colon-v1-2-c04abc180fcd@fairphone.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18 17:54:58 +03:00
Frank Wunderlich
bd9e0f5d90 dt-bindings: interconnect: add mt7988-cci compatible
Add compatible for Mediatek MT7988 SoC with mediatek,mt8183-cci fallback
which is taken by driver.

Signed-off-by: Frank Wunderlich <frank-w@public-files.de>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Georgi Djakov <djakov@kernel.org>
Link: https://lore.kernel.org/r/20250706132213.20412-8-linux@fw-web.de
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
2025-07-07 10:57:03 +02:00
Georgi Djakov
5fed7fe33c Merge branch 'icc-sa8775p' into icc-next
Add Epoch Subsystem (EPSS) L3 provider support on SA8775P SoCs.

Current interconnect framework is based on static IDs for creating node
and registering with framework. This becomes a limitation for topologies
where there are multiple instances of same interconnect provider.
Modified interconnect framework APIs to create and link icc node with
dynamic IDs, this will help to overcome the dependency on static IDs.

* icc-sa8775p
  dt-bindings: interconnect: Add EPSS L3 compatible for SA8775P
  interconnect: core: Add dynamic id allocation support
  interconnect: qcom: Add multidev EPSS L3 support
  interconnect: qcom: icc-rpmh: Add dynamic icc node id support
  interconnect: qcom: sa8775p: Add dynamic icc node id support

Link: https://lore.kernel.org/r/20250415095343.32125-1-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-05-19 17:09:50 +03:00
Krzysztof Kozlowski
af73692e7b dt-bindings: interconnect: Correct indentation and style in DTS example
DTS example in the bindings should be indented with 2- or 4-spaces and
aligned with opening '- |', so correct any differences like 3-spaces or
mixtures 2- and 4-spaces in one binding.  While re-indenting, drop
unused labels.

No functional changes here, but saves some comments during reviews of
new patches built on existing code.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: "Rob Herring (Arm)" <robh@kernel.org>
Link: https://lore.kernel.org/r/20250324125302.82167-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-04-28 17:46:35 +03:00
Raviteja Laggyshetty
289198fb51 dt-bindings: interconnect: Add EPSS L3 compatible for SA8775P
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on
SA8775P SoCs.
The L3 instance on the SA8775P SoC is similar to those on SoCs
like SM8250 and SC7280. These SoCs use the PERF register instead
of L3_REG for programming the performance level, which is managed
in the data associated with the target-specific compatibles.
Since the hardware remains the same across all EPSS-supporting SoCs,
the generic compatible is retained for all SoCs.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
Link: https://lore.kernel.org/r/20250415095343.32125-2-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-04-15 14:13:30 +03:00
Georgi Djakov
4cc0047169 Merge branch 'icc-sm8750' into icc-next
Add interconnect support for SM8750 SoC.

The Qualcomm Technologies, Inc. SM8750 SoC is the latest in the line of
consumer mobile device SoCs.

* icc-sm8750
  dt-bindings: interconnect: add interconnect bindings for SM8750
  interconnect: qcom: Add interconnect provider driver for SM8750
  interconnect: sm8750: Add missing const to static qcom_icc_desc

Link: https://lore.kernel.org/r/20241204-sm8750_master_interconnects-v3-0-3d9aad4200e9@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-14 00:13:23 +02:00
Shivnandan Kumar
94f51cbb34 dt-bindings: interconnect: qcom,msm8998-bwmon: Add SM8750 CPU BWMONs
Document the SM8750 BWMONs, which has one instance per cluster of
BWMONv4.

Signed-off-by: Shivnandan Kumar <quic_kshivnan@quicinc.com>
Signed-off-by: Melody Olvera <quic_molvera@quicinc.com>
Link: https://lore.kernel.org/r/20250113-sm8750_bwmon_master-v1-1-f082da3a3308@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-14 00:12:49 +02:00
Neil Armstrong
f56c1b6db5 dt-bindings: interconnect: OSM L3: Document sm8650 OSM L3 compatible
Document the OSM L3 found in the Qualcomm SM8650 platform.

Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250110-topic-sm8650-ddr-bw-scaling-v1-1-041d836b084c@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-13 20:00:25 +02:00
Lijuan Gao
576a67fbec dt-bindings: interconnect: qcom-bwmon: Document QCS615 bwmon compatibles
Document QCS615 BWMONs, which includes one BWMONv4 instance for CPU to
LLCC path bandwidth monitoring and one BWMONv5 instance for LLCC to DDR
path bandwidth monitoring.

Signed-off-by: Lijuan Gao <quic_lijuang@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20241218-add_bwmon_support_for_qcs615-v1-1-680d798a19e5@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-13 20:00:25 +02:00
Raviteja Laggyshetty
2102773c60 dt-bindings: interconnect: add interconnect bindings for SM8750
Add interconnect device bindings. These devices can be used
to describe any RPMh and NoC based interconnect devices.

Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
Signed-off-by: Melody Olvera <quic_molvera@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20241204-sm8750_master_interconnects-v3-1-3d9aad4200e9@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-12-17 14:05:37 +02:00
Georgi Djakov
b1fd28da86 Merge branch 'icc-sar2130p' into icc-next
Add driver for the network of connects present on the SAR2130P platform.

* icc-sar2130p
  dt-bindings: interconnect: qcom: document SAR2130P NoC
  interconnect: qcom: add support for SAR2130P

Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-0-c58c73dcd19d@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05 01:32:05 +02:00
Georgi Djakov
55aac0ea75 Merge branch 'icc-qcs615' into icc-next
Add interconnect dt-bindings and driver support for Qualcomm QCS615 SoC.

* icc-qcs615
  dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS615 SoC
  interconnect: qcom: add QCS615 interconnect provider driver

Link: https://lore.kernel.org/r/20240924143958.25-1-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05 01:30:52 +02:00
Georgi Djakov
3b7dd9d88c Merge branch 'icc-qcs8300' into icc-next
Add interconnect support for QCS8300 SoC

* icc-qcs8300
  dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS8300 SoC
  interconnect: qcom: add QCS8300 interconnect provider driver

Link: https://lore.kernel.org/r/20240910101013.3020-1-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05 01:28:34 +02:00
Jingyi Wang
c603accc26 dt-bindings: interconnect: qcom-bwmon: Document QCS8300 bwmon compatibles
Document QCS8300 BWMONs, which has two BWMONv4 instances for the CPU->LLCC
path and one BWMONv5 instance for LLCC->DDR path.

Signed-off-by: Jingyi Wang <quic_jingyw@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Link: https://lore.kernel.org/r/20240925-qcs8300_bwmon_binding-v1-1-a7bfd94b2854@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22 13:04:35 +03:00
Dmitry Baryshkov
bc2bb73216 dt-bindings: interconnect: qcom: document SAR2130P NoC
Add bindings for the Network of Connects (NoC) present on the
Qualcomm SAR2130P platform.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-1-c58c73dcd19d@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22 12:27:31 +03:00
Raviteja Laggyshetty
6c5e948f1f dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS615 SoC
Document the RPMh Network-On-Chip Interconnect of the QCS615 platform.

Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Link: https://lore.kernel.org/r/20240924143958.25-2-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22 11:30:02 +03:00
Raviteja Laggyshetty
6fa115569d dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS8300 SoC
Document the RPMh Network-On-Chip Interconnect of the QCS8300 platform.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
Link: https://lore.kernel.org/r/20240910101013.3020-2-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22 11:21:45 +03:00
Greg Kroah-Hartman
9d06852b24 Merge tag 'icc-6.12-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/djakov/icc into char-misc-next
Georgi writes:

interconnect changes for 6.12

This pull request contains the interconnect changes for the 6.12-rc1 merge
window. It contains new drivers and fixes with the following highlights:

Driver changes:
- New driver for MSM8976 platforms
- New driver for MSM8937 platforms
- Enable sync_state for SM8250 platforms
- Enable QoS support for QCS404
- Add ab_coeff bandwidth adjustments for MSM8953
- Drop the unsupported yet DISP nodes on SM8350 platforms
- Fix missed num_nodes initialization in icc-clk driver
- Misc DT and documentation fixes

Signed-off-by: Georgi Djakov <djakov@kernel.org>

* tag 'icc-6.12-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/djakov/icc:
  dt-bindings: interconnect: qcom: Do not require reg for sc8180x virt NoCs
  dt-bindings: interconnect: qcom-bwmon: Document SA8775p bwmon compatibles
  dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in description
  interconnect: qcom: msm8953: Add ab_coeff
  dt-bindings: interconnect: qcom: msm8939: Fix example
  interconnect: qcom: qcs404: Add regmaps and more bus descriptions
  interconnect: qcom: qcs404: Mark AP-owned nodes as such
  interconnect: qcom: Add MSM8937 interconnect provider driver
  interconnect: qcom: sm8250: Enable sync_state
  dt-bindings: interconnect: qcom,sm8350: drop DISP nodes
  interconnect: qcom: sm8350: drop DISP nodes
  dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoC
  interconnect: qcom: Add MSM8976 interconnect provider driver
  dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoC
  interconnect: icc-clk: Add missed num_nodes initialization
  dt-bindings: interconnect: qcom,rpmh: correct sm8150 camnoc
2024-09-06 19:17:16 +02:00
Georgi Djakov
f7d27c1cc8 Merge branch 'icc-misc' into icc-next
This series introduce new ICC drivers for some legacy socs
while at it also updates a bit of qcs404 driver which seems
to not receive much attention lately.

* icc-misc
  dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoC
  interconnect: qcom: Add MSM8976 interconnect provider driver
  dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoC
  interconnect: qcom: Add MSM8937 interconnect provider driver
  interconnect: qcom: qcs404: Mark AP-owned nodes as such
  interconnect: qcom: qcs404: Add regmaps and more bus descriptions
  dt-bindings: interconnect: qcom: msm8939: Fix example
  interconnect: qcom: msm8953: Add ab_coeff
  dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in description

Link: https://lore.kernel.org/all/20240709102728.15349-1-a39.skl@gmail.com/
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-26 01:36:14 +03:00
Georgi Djakov
0af96a3e95 dt-bindings: interconnect: qcom: Do not require reg for sc8180x virt NoCs
The virtual interconnect providers do not have their own IO address space,
but this is not documented in the DT schema and the following warnings are
reported by dtbs_check:

sc8180x-lenovo-flex-5g.dtb: interconnect-camnoc-virt: 'reg' is a required property
sc8180x-lenovo-flex-5g.dtb: interconnect-mc-virt: 'reg' is a required property
sc8180x-lenovo-flex-5g.dtb: interconnect-qup-virt: 'reg' is a required property
sc8180x-primus.dtb: interconnect-camnoc-virt: 'reg' is a required property
sc8180x-primus.dtb: interconnect-mc-virt: 'reg' is a required property
sc8180x-primus.dtb: interconnect-qup-virt: 'reg' is a required property

Fix this by adding them to the list of compatibles that do not require
the reg property.

Link: https://lore.kernel.org/r/20240730141016.1142608-1-djakov@kernel.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-26 01:35:50 +03:00
Tengfei Fan
647eaa8f54 dt-bindings: interconnect: qcom-bwmon: Document SA8775p bwmon compatibles
Document the compatibles used to describe the bwmons present on the
SA8775p platform.

Signed-off-by: Tengfei Fan <quic_tengfan@quicinc.com>
Link: https://lore.kernel.org/r/20240730-add_sa8775p_bwmon-v1-1-f4f878da29ae@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-26 01:34:16 +03:00
Adam Skladowski
69704bbbc0 dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in description
"See also" in description seems to be wrongly defined,
make it inline with other yamls.

Fixes: 791ed23f73 ("dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC")
Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20240709102728.15349-10-a39.skl@gmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-24 02:54:43 +03:00
Adam Skladowski
123d2b96c1 dt-bindings: interconnect: qcom: msm8939: Fix example
For now example list snoc_mm as children of bimc which is obviously
not valid, drop bimc and move snoc_mm into snoc.

Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Link: https://lore.kernel.org/r/20240709102728.15349-8-a39.skl@gmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-24 02:54:43 +03:00
Adam Skladowski
4937dc0ffc dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoC
Add bindings for Qualcomm MSM8937 Network-On-Chip interconnect devices.

Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20240709102728.15349-4-a39.skl@gmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23 21:19:38 +03:00
Adam Skladowski
e5b9032b1b dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoC
Add bindings for Qualcomm MSM8976 Network-On-Chip interconnect devices.

Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20240709102728.15349-2-a39.skl@gmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23 21:19:16 +03:00
Rayyan Ansari
7d59b1ff71 dt-bindings: interconnect: qcom,rpmh: correct sm8150 camnoc
The sm8150 camnoc interconnect was mistakenly documented as
"qcom,sm8150-camnoc-noc", for which there is no reference to in
drivers or device tree.

Correct this to "qcom,sm8150-camnoc-virt".

Signed-off-by: Rayyan Ansari <rayyan.ansari@linaro.org>
Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240716144738.109823-1-rayyan.ansari@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23 18:39:29 +03:00
Konrad Dybcio
0710c3d304 dt-bindings: Batch-update Konrad Dybcio's email
Use my @kernel.org address everywhere.

Signed-off-by: Konrad Dybcio <konradybcio@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240726-topic-konrad_email-v1-3-f94665da2919@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2024-07-29 13:35:47 -06:00
Linus Torvalds
acc5965b9f Merge tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc
Pull char / misc and other driver updates from Greg KH:
 "Here is the "big" set of char/misc and other driver subsystem changes
  for 6.11-rc1. Nothing major in here, just loads of new drivers and
  updates. Included in here are:

   - IIO api updates and new drivers added

   - wait_interruptable_timeout() api cleanups for some drivers

   - MODULE_DESCRIPTION() additions for loads of drivers

   - parport out-of-bounds fix

   - interconnect driver updates and additions

   - mhi driver updates and additions

   - w1 driver fixes

   - binder speedups and fixes

   - eeprom driver updates

   - coresight driver updates

   - counter driver update

   - new misc driver additions

   - other minor api updates

  All of these, EXCEPT for the final Kconfig build fix for 32bit
  systems, have been in linux-next for a while with no reported issues.
  The Kconfig fixup went in 29 hours ago, so might have missed the
  latest linux-next, but was acked by everyone involved"

* tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (330 commits)
  misc: Kconfig: exclude mrvl-cn10k-dpi compilation for 32-bit systems
  misc: delete Makefile.rej
  binder: fix hang of unregistered readers
  misc: Kconfig: add a new dependency for MARVELL_CN10K_DPI
  virtio: add missing MODULE_DESCRIPTION() macro
  agp: uninorth: add missing MODULE_DESCRIPTION() macro
  spmi: add missing MODULE_DESCRIPTION() macros
  dev/parport: fix the array out-of-bounds risk
  samples: configfs: add missing MODULE_DESCRIPTION() macro
  misc: mrvl-cn10k-dpi: add Octeon CN10K DPI administrative driver
  misc: keba: Fix missing AUXILIARY_BUS dependency
  slimbus: Fix struct and documentation alignment in stream.c
  MAINTAINERS: CC dri-devel list on Qualcomm FastRPC patches
  misc: fastrpc: use coherent pool for untranslated Compute Banks
  misc: fastrpc: support complete DMA pool access to the DSP
  misc: fastrpc: add missing MODULE_DESCRIPTION() macro
  misc: fastrpc: Add missing dev_err newlines
  misc: fastrpc: Use memdup_user()
  nvmem: core: Implement force_ro sysfs attribute
  nvmem: Use sysfs_emit() for type attribute
  ...
2024-07-19 15:55:08 -07:00
Georgi Djakov
226e58b209 Merge branch 'icc-rpmh-qos' into icc-next
This series adds QoS support for QNOC type device which can be found on
SC7280 platform. It adds support for programming priority,
priority forward disable and urgency forwarding. This helps in
priortizing the traffic originating from different interconnect masters
at NOC (Network On Chip).

* icc-rpmh-qos
  dt-bindings: interconnect: add clock property to enable QOS on SC7280
  interconnect: qcom: icc-rpmh: Add QoS configuration support
  interconnect: qcom: sc7280: enable QoS configuration
  interconnect: qcom: Fix DT backwards compatibility for QoS

Link: https://lore.kernel.org/r/20240607173927.26321-1-quic_okukatla@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-07-04 22:45:20 +03:00
Georgi Djakov
19990ff048 Merge branch 'icc-msm8953' into icc-next
Add interconnect driver for MSM8953-based devices.

* icc-msm8953
  dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC
  interconnect: qcom: Add MSM8953 driver

Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-0-a70d582182dc@mainlining.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-07-04 22:41:12 +03:00
Vladimir Lypak
791ed23f73 dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC
Add the device-tree bindings for interconnect providers
used on MSM8953 platform.

Signed-off-by: Vladimir Lypak <vladimir.lypak@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org>
Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-1-a70d582182dc@mainlining.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-06-28 21:11:14 +03:00
Sibi Sankar
530c66142e dt-bindings: interconnect: qcom,msm8998-bwmon: Add X1E80100 BWMON instances
Document X1E80100 BWMONs, which has multiple (one per cluster) BWMONv4
instances for the CPU->LLCC path and one BWMONv5 instance for LLCC->DDR
path.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com>
Acked-by: Georgi Djakov <djakov@kernel.org>
Link: https://lore.kernel.org/r/20240624092214.146935-3-quic_sibis@quicinc.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2024-06-25 23:22:43 -05:00
Sibi Sankar
f92e224e7a dt-bindings: interconnect: qcom,msm8998-bwmon: Remove opp-table from the required list
Remove opp-table from the required list as the bindings shouldn't care
where the OPP tables (referenced by the operating-points-v2 property)
comes from.

Suggested-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Georgi Djakov <djakov@kernel.org>
Link: https://lore.kernel.org/r/20240624092214.146935-2-quic_sibis@quicinc.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2024-06-25 23:22:43 -05:00
Odelu Kukatla
6822b0c92b dt-bindings: interconnect: add clock property to enable QOS on SC7280
Add clock property to enable the clocks required for accessing
QoS configuration registers.

Signed-off-by: Odelu Kukatla <quic_okukatla@quicinc.com>
Acked-by: "Rob Herring (Arm)" <robh@kernel.org>
Link: https://lore.kernel.org/r/20240607173927.26321-4-quic_okukatla@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-06-24 15:20:27 +03:00