Pull devicetree updates from Rob Herring:
"Bindings:
- DT schema conversions for Samsung clocks, RNG bindings, Qcom
Command DB and rmtfs, gpio-restart, i2c-mux-gpio, i2c-mux-pinctl,
Tegra I2C and BPMP, pwm-vibrator, Arm DSU, and Cadence macb
- DT schema conversions for Broadcom platforms: interrupt
controllers, STB GPIO, STB waketimer, STB reset, iProc MDIO mux,
iProc PCIe, Cygnus PCIe PHY, PWM, USB BDC, BCM6328 LEDs, TMON,
SYSTEMPORT, AMAC, Northstar 2 PCIe PHY, GENET, moca PHY, GISB
arbiter, and SATA
- Add binding schemas for Tegra210 EMC table, TI DC-DC converters,
- Clean-ups of MDIO bus schemas to fix 'unevaluatedProperties' issues
- More fixes due to 'unevaluatedProperties' enabling
- Data type fixes and clean-ups of binding examples found in
preparation to move to validating DTB files directly (instead of
intermediate YAML representation.
- Vendor prefixes for T-Head Semiconductor, OnePlus, and Sunplus
- Add various new compatible strings
DT core:
- Silence a warning for overlapping reserved memory regions
- Reimplement unittest overlay tracking
- Fix stack frame size warning in unittest
- Clean-ups of early FDT scanning functions
- Fix handling of "linux,usable-memory-range" on EFI booted systems
- Add support for 'fail' status on CPU nodes
- Improve error message in of_phandle_iterator_next()
- kbuild: Disable duplicate unit-address warnings for disabled nodes"
* tag 'devicetree-for-5.17' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (114 commits)
dt-bindings: net: mdio: Drop resets/reset-names child properties
dt-bindings: clock: samsung: convert S5Pv210 to dtschema
dt-bindings: clock: samsung: convert Exynos5410 to dtschema
dt-bindings: clock: samsung: convert Exynos5260 to dtschema
dt-bindings: clock: samsung: extend Exynos7 bindings with UFS
dt-bindings: clock: samsung: convert Exynos7 to dtschema
dt-bindings: clock: samsung: convert Exynos5433 to dtschema
dt-bindings: i2c: maxim,max96712: Add bindings for Maxim Integrated MAX96712
dt-bindings: iio: adi,ltc2983: Fix 64-bit property sizes
dt-bindings: power: maxim,max17040: Fix incorrect type for 'maxim,rcomp'
dt-bindings: interrupt-controller: arm,gic-v3: Fix 'interrupts' cell size in example
dt-bindings: iio/magnetometer: yamaha,yas530: Fix invalid 'interrupts' in example
dt-bindings: clock: imx5: Drop clock consumer node from example
dt-bindings: Drop required 'interrupt-parent'
dt-bindings: net: ti,dp83869: Drop value on boolean 'ti,max-output-impedance'
dt-bindings: net: wireless: mt76: Fix 8-bit property sizes
dt-bindings: PCI: snps,dw-pcie-ep: Drop conflicting 'max-functions' schema
dt-bindings: i2c: st,stm32-i2c: Make each example a separate entry
dt-bindings: net: stm32-dwmac: Make each example a separate entry
dt-bindings: net: Cleanup MDIO node schemas
...
Pull thermal control updates from Rafael Wysocki:
"These add a new driver for Renesas RZ/G2L TSU, update a few existing
thermal control drivers and clean up the tmon utility.
Specifics:
- Add new TSU driver and DT bindings for the Renesas RZ/G2L platform
(Biju Das).
- Fix missing check when calling reset_control_deassert() in the
rz2gl thermal driver (Biju Das).
- In preparation for FORTIFY_SOURCE performing compile-time and
run-time field bounds checking for memcpy(), avoid intentionally
writing across neighboring fields in the int340x thermal control
driver (Kees Cook).
- Fix RFIM mailbox write commands handling in the int340x thermal
control driver (Sumeet Pawnikar).
- Fix PM issue occurring in the iMX thermal control driver during
suspend/resume by implementing PM runtime support in it (Oleksij
Rempel).
- Add 'const' annotation to thermal_cooling_ops in the Intel
powerclamp driver (Rikard Falkeborn).
- Fix missing ADC bit set in the iMX8MP thermal driver to enable the
sensor (Paul Gerber).
- Drop unused local variable definition from tmon (ran jianping)"
* tag 'thermal-5.17-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/int340x: Fix RFIM mailbox write commands
thermal/drivers/rz2gl: Add error check for reset_control_deassert()
thermal/drivers/imx8mm: Enable ADC when enabling monitor
thermal/drivers: Add TSU driver for RZ/G2L
dt-bindings: thermal: Document Renesas RZ/G2L TSU
thermal/drivers/intel_powerclamp: Constify static thermal_cooling_device_ops
thermal/drivers/imx: Implement runtime PM support
thermal: tools: tmon: remove unneeded local variable
thermal: int340x: Use struct_group() for memcpy() region
Convert the Tegra186 (and later) BPMP thermal device tree bindings from
the free-form text format to json-schema.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
When converting the thermal-zones bindings to yaml the definition of the
contribution property changed. The intention is the same, an integer
value expressing a ratio of a sum on how much cooling is provided by the
device to the zone. But after the conversion the integer value is
limited to the range 0 to 100 and expressed as a percentage.
This is problematic for two reasons.
- This do not match how the binding is used. Out of the 18 files that
make use of the property only two (ste-dbx5x0.dtsi and
ste-hrefv60plus.dtsi) sets it at a value that satisfy the binding,
100. The remaining 16 files set the value higher and fail to validate.
- Expressing the value as a percentage instead of a ratio of the sum is
confusing as there is nothing to enforce the sum in the zone is not
greater then 100.
This patch restore the pre yaml conversion description and removes the
value limitation allowing the usage of the bindings to validate.
Fixes: 1202a442a3 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Reported-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20211109103045.1403686-1-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Rob Herring <robh@kernel.org>
The tsadc node in rk356x.dtsi has more resets defined then currently
allowed by rockchip-thermal.yaml, so fix that in the documentation.
The driver now uses the devm_reset_control_array_get() function,
so reset-names is no longer required, but keep it for legacy reasons.
Signed-off-by: Johan Jonker <jbx6244@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930110517.14323-1-jbx6244@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Pull thermal updates from Daniel Lezcano:
- Add the tegra3 thermal sensor and fix the compilation testing on
tegra by adding a dependency on ARCH_TEGRA along with COMPILE_TEST
(Dmitry Osipenko)
- Fix the error code for the exynos when devm_get_clk() fails (Dan
Carpenter)
- Add the TCC cooling support for AlderLake platform (Sumeet Pawnikar)
- Add support for hardware trip points for the rcar gen3 thermal driver
and store TSC id as unsigned int (Niklas Söderlund)
- Replace the deprecated CPU-hotplug functions get_online_cpus() and
put_online_cpus (Sebastian Andrzej Siewior)
- Add the thermal tools directory in the MAINTAINERS file (Daniel
Lezcano)
- Fix the Makefile and the cross compilation flags for the userspace
'tmon' tool (Rolf Eike Beer)
- Allow to use the IMOK independently from the GDDV on Int340x (Sumeet
Pawnikar)
- Fix the stub thermal_cooling_device_register() function prototype
which does not match the real function (Arnd Bergmann)
- Make the thermal trip point optional in the DT bindings (Maxime
Ripard)
- Fix a typo in a comment in the core code (Geert Uytterhoeven)
- Reduce the verbosity of the trace in the SoC thermal tegra driver
(Dmitry Osipenko)
- Add the support for the LMh (Limit Management hardware) driver on the
QCom platforms (Thara Gopinath)
- Allow processing of HWP interrupt by adding a weak function in the
Intel driver (Srinivas Pandruvada)
- Prevent an abort of the sensor probe is a channel is not used
(Matthias Kaehlcke)
* tag 'thermal-v5.15-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/drivers/qcom/spmi-adc-tm5: Don't abort probing if a sensor is not used
thermal/drivers/intel: Allow processing of HWP interrupt
dt-bindings: thermal: Add dt binding for QCOM LMh
thermal/drivers/qcom: Add support for LMh driver
firmware: qcom_scm: Introduce SCM calls to access LMh
thermal/drivers/tegra-soctherm: Silence message about clamped temperature
thermal: Spelling s/scallbacks/callbacks/
dt-bindings: thermal: Make trips node optional
thermal/core: Fix thermal_cooling_device_register() prototype
thermal/drivers/int340x: Use IMOK independently
tools/thermal/tmon: Add cross compiling support
thermal/tools/tmon: Improve the Makefile
MAINTAINERS: Add missing userspace thermal tools to the thermal section
thermal/drivers/intel_powerclamp: Replace deprecated CPU-hotplug functions.
thermal/drivers/rcar_gen3_thermal: Store TSC id as unsigned int
thermal/drivers/rcar_gen3_thermal: Add support for hardware trip points
drivers/thermal/intel: Add TCC cooling support for AlderLake platform
thermal/drivers/exynos: Fix an error code in exynos_tmu_probe()
thermal/drivers/tegra: Correct compile-testing of drivers
thermal/drivers/tegra: Add driver for Tegra30 thermal sensor
Even though the previous binding made it a required child node, the
implementation in Linux never made it mandatory and just ignored thermal
zones without trip points.
This was even effectively encouraged, since the thermal core wouldn't
allow a thermal sensor to probe without a thermal zone.
In the case where you had a thermal device that had multiple sensors but
with enough knowledge to provide trip points for only a few of them,
this meant that the only way to make that driver probe was to provide a
thermal zone without the trips node required by the binding.
This obviously led to a fair number of device trees doing exactly that,
making the initial binding requirement ineffective.
Let's make it clear by dropping that requirement.
Cc: Amit Kucheria <amitk@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Maxime Ripard <maxime@cerno.tech>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210721140424.725744-34-maxime@cerno.tech
Pull thermal updates from Daniel Lezcano:
- Add rk3568 sensor support (Finley Xiao)
- Add missing MODULE_DEVICE_TABLE for the Spreadtrum sensor (Chunyan
Zhang)
- Export additionnal attributes for the int340x thermal processor
(Srinivas Pandruvada)
- Add SC7280 compatible for the tsens driver (Rajeshwari Ravindra
Kamble)
- Fix kernel documentation for thermal_zone_device_unregister() and use
devm_platform_get_and_ioremap_resource() (Yang Yingliang)
- Fix coefficient calculations for the rcar_gen3 sensor driver (Niklas
Söderlund)
- Fix shadowing variable rcar_gen3_ths_tj_1 (Geert Uytterhoeven)
- Add missing of_node_put() for the iMX and Spreadtrum sensors
(Krzysztof Kozlowski)
- Add tegra3 thermal sensor DT bindings (Dmitry Osipenko)
- Stop the thermal zone monitoring when unregistering it to prevent a
temperature update without the 'get_temp' callback (Dmitry Osipenko)
- Add rk3568 DT bindings, convert bindings to yaml schemas and add the
corresponding compatible in the Rockchip sensor (Ezequiel Garcia)
- Add the sc8180x compatible for the Qualcomm tsensor (Bjorn Andersson)
- Use the find_first_zero_bit() function instead of custom code (Andy
Shevchenko)
- Fix the kernel doc for the device cooling device (Yang Li)
- Reorg the processor thermal int340x to set the scene for the PCI mmio
driver (Srinivas Pandruvada)
- Add PCI MMIO driver for the int340x processor thermal driver
(Srinivas Pandruvada)
- Add hwmon sensors for the mediatek sensor (Frank Wunderlich)
- Fix warning for return value reported by Smatch for the int340x
thermal processor (Srinivas Pandruvada)
- Fix wrong register access and decoding for the int340x thermal
processor (Srinivas Pandruvada)
* tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (23 commits)
thermal/drivers/int340x/processor_thermal: Fix tcc setting
thermal/drivers/int340x/processor_thermal: Fix warning for return value
thermal/drivers/mediatek: Add sensors-support
thermal/drivers/int340x/processor_thermal: Add PCI MMIO based thermal driver
thermal/drivers/int340x/processor_thermal: Split enumeration and processing part
thermal: devfreq_cooling: Fix kernel-doc
thermal/drivers/intel/intel_soc_dts_iosf: Switch to use find_first_zero_bit()
dt-bindings: thermal: tsens: Add sc8180x compatible
dt-bindings: rockchip-thermal: Support the RK3568 SoC compatible
dt-bindings: thermal: convert rockchip-thermal to json-schema
thermal/core/thermal_of: Stop zone device before unregistering it
dt-bindings: thermal: Add binding for Tegra30 thermal sensor
thermal/drivers/sprd: Add missing of_node_put for loop iteration
thermal/drivers/imx_sc: Add missing of_node_put for loop iteration
thermal/drivers/rcar_gen3_thermal: Do not shadow rcar_gen3_ths_tj_1
thermal/drivers/rcar_gen3_thermal: Fix coefficient calculations
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
thermal/core: Correct function name thermal_zone_device_unregister()
dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280
thermal/drivers/int340x: processor_thermal: Export additional attributes
...
All NVIDIA Tegra30 SoCs have on-chip sensors which monitor temperature
and voltage of the SoC. Sensors also controls CPU x2 freq throttle and
emits emergency shutdown signal. TSENSOR has has two separate channels
for each sensor placed in a different parts of the SoC. Add binding for
the sensor hardware.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Dmitry Osipenko <digetx@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210616190417.32214-2-digetx@gmail.com
Pull thermal updates from Daniel Lezcano:
- Remove duplicate error message for the amlogic driver (Tang Bin)
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of a
couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well as
the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of cleanups
and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
* tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits)
thermal/drivers/mtk_thermal: Remove redundant initializations of several variables
thermal/core/power allocator: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Lock the thermal zone while looping over instances
thermal/core/power_allocator: Update once cooling devices when temp is low
thermal/core/power_allocator: Maintain the device statistics from going stale
thermal/core: Create a helper __thermal_cdev_update() without a lock
dt-bindings: thermal: tsens: Document ipq8064 bindings
thermal/drivers/tsens: Add support for ipq8064-tsens
thermal/drivers/tsens: Drop unused define for msm8960
thermal/drivers/tsens: Replace custom 8960 apis with generic apis
thermal/drivers/tsens: Fix bug in sensor enable for msm8960
thermal/drivers/tsens: Use init_common for msm8960
thermal/drivers/tsens: Add VER_0 tsens version
thermal/drivers/tsens: Convert msm8960 to reg_field
thermal/drivers/tsens: Don't hardcode sensor slope
Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
thermal/core: Remove thermal_notify_framework
iwlwifi: mvm: tt: Replace thermal_notify_framework
dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
...
When adding support for V3U (r8a779a0) it was incorrectly recorded it
supports four nodes, while in fact it supports five. The fifth node is
named TSC0 and breaks the existing naming schema starting at 1. Work
around this by separately defining the reg property for V3U and others.
Restore the maximum number of nodes to three for other compatibles as
it was before erroneously increasing it for V3U.
Fixes: d7fdfb6541 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a779a0 support")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210310110716.3297544-1-niklas.soderlund+renesas@ragnatech.se
Pull devicetree updates from Rob Herring:
- Sync dtc to upstream version v1.6.0-51-g183df9e9c2b9 and build host
fdtoverlay
- Add kbuild support to build DT overlays (%.dtbo)
- Drop NULLifying match table in of_match_device().
In preparation for this, there are several driver cleanups to use
(of_)?device_get_match_data().
- Drop pointless wrappers from DT struct device API
- Convert USB binding schemas to use graph schema and remove old plain
text graph binding doc
- Convert spi-nor and v3d GPU bindings to DT schema
- Tree wide schema fixes for if/then schemas, array size constraints,
and undocumented compatible strings in examples
- Handle 'no-map' correctly for already reserved memblock regions
* tag 'devicetree-for-5.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (35 commits)
driver core: platform: Drop of_device_node_put() wrapper
of: Remove of_dev_{get,put}()
dt-bindings: usb: Change descibe to describe in usbmisc-imx.txt
dt-bindings: can: rcar_canfd: Group tuples in pin control properties
dt-bindings: power: renesas,apmu: Group tuples in cpus properties
dt-bindings: mtd: spi-nor: Convert to DT schema format
dt-bindings: Use portable sort for version cmp
dt-bindings: ethernet-controller: fix fixed-link specification
dt-bindings: irqchip: Add node name to PRUSS INTC
dt-bindings: interconnect: Fix the expected number of cells
dt-bindings: Fix errors in 'if' schemas
dt-bindings: iommu: renesas,ipmmu-vmsa: Make 'power-domains' conditionally required
dt-bindings: Fix undocumented compatible strings in examples
kbuild: Add support to build overlays (%.dtbo)
scripts: dtc: Remove the unused fdtdump.c file
scripts: dtc: Build fdtoverlay tool
scripts/dtc: Update to upstream version v1.6.0-51-g183df9e9c2b9
scripts: dtc: Fetch fdtoverlay.c from external DTC project
dt-bindings: thermal: sun8i: Fix misplaced schema keyword in compatible strings
dt-bindings: iio: dac: Fix AD5686 references
...
Pull thermal updates from Daniel Lezcano:
- Fix Kconfig typo "acces" -> "access" (Colin Ian King)
- Use dev_error_probe() to simplify the error handling on imx and imx8
platforms (Anson Huang)
- Use dedicated kobj_to_dev() instead of container_of() in the sysfs
core code (Tian Tao)
- Fix coding style by adding braces to a one line conditional statement
on rcar (Geert Uytterhoeven)
- Add DT binding documentation for the r8a774e1 platform and update the
Kconfig description supporting RZ/G2 SoCs (Lad Prabhakar)
- Simplify the return expression of stm_thermal_prepare on the stm32
platform (Qinglang Miao)
- Fix the unit in the function documentation for the idle injection
cooling device (Zhuguang Qing)
- Remove an unecessary mutex_init() in the core code (Qinglang Miao)
- Add support for keep alive events in the core code and the specific
int340x (Srinivas Pandruvada)
- Remove unused thermal zone variable in devfreq and cpufreq cooling
devices (Zhuguang Qing)
- Add the A100's THS controller support (Yangtao Li)
- Add power management on the omap3's bandgap sensor (Adam Ford)
- Fix a missing nlmsg_free in the netlink core error path (Jing
Xiangfeng)
* tag 'thermal-v5.10-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal: core: Adding missing nlmsg_free() in thermal_genl_sampling_temp()
thermal: ti-soc-thermal: Enable addition power management
thermal: sun8i: Add A100's THS controller support
thermal: sun8i: add TEMP_CALIB_MASK for calibration data in sun50i_h6_ths_calibrate
dt-bindings: thermal: sun8i: Add binding for A100's THS controller
thermal: cooling: Remove unused variable *tz
thermal: int340x: Add keep alive response method
thermal: core: Add new event for sending keep alive notifications
thermal: int340x: Provide notification for OEM variable change
thermal: core: remove unnecessary mutex_init()
thermal/idle_inject: Fix comment of idle_duration_us and name of latency_ns
thermal: Kconfig: Update description for RCAR_GEN3_THERMAL config
thermal: stm32: simplify the return expression of stm_thermal_prepare()
dt-bindings: thermal: rcar-gen3-thermal: Add r8a774e1 support
thermal: rcar_thermal: Add missing braces to conditional statement
thermal: Use kobj_to_dev() instead of container_of()
thermal: imx8mm: Use dev_err_probe() to simplify error handling
thermal: imx: Use dev_err_probe() to simplify error handling
drivers: thermal: Kconfig: fix spelling mistake "acces" -> "access"
DTSes with new i.MX 8M SoCs introduce their own compatibles so add them
to fix dtbs_check warnings like:
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible:0: 'fsl,imx8mn-tmu' is not one of ['fsl,imx8mm-tmu', 'fsl,imx8mp-tmu']
From schema: Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible: ['fsl,imx8mn-tmu', 'fsl,imx8mm-tmu'] is too long
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible: Additional items are not allowed ('fsl,imx8mm-tmu' was unexpected)
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Pull thermal updates from Daniel Lezcano:
- Add support to enable/disable the thermal zones resulting on core
code and drivers cleanup (Andrzej Pietrasiewicz)
- Add generic netlink support for userspace notifications: events,
temperature and discovery commands (Daniel Lezcano)
- Fix redundant initialization for a ret variable (Colin Ian King)
- Remove the clock cooling code as it is used nowhere (Amit Kucheria)
- Add the rcar_gen3_thermal's r8a774e1 support (Marian-Cristian
Rotariu)
- Replace all references to thermal.txt in the documentation to the
corresponding yaml files (Amit Kucheria)
- Add maintainer entry for the IPA (Lukasz Luba)
- Add support for MSM8939 for the tsens (Shawn Guo)
- Update power allocator and devfreq cooling to SPDX licensing (Lukasz
Luba)
- Add Cannon Lake Low Power PCH support (Sumeet Pawnikar)
- Add tsensor support for V2 mediatek thermal system (Henry Yen)
- Fix thermal zone lookup by ID for the core code (Thierry Reding)
* tag 'thermal-v5.9-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (40 commits)
thermal: intel: intel_pch_thermal: Add Cannon Lake Low Power PCH support
thermal: mediatek: Add tsensor support for V2 thermal system
thermal: mediatek: Prepare to add support for other platforms
thermal: Update power allocator and devfreq cooling to SPDX licensing
MAINTAINERS: update entry to thermal governors file name prefixing
thermal: core: Add thermal zone enable/disable notification
thermal: qcom: tsens-v0_1: Add support for MSM8939
dt-bindings: tsens: qcom: Document MSM8939 compatible
thermal: core: Fix thermal zone lookup by ID
thermal: int340x: processor_thermal: fix: update Jasper Lake PCI id
thermal: imx8mm: Support module autoloading
thermal: ti-soc-thermal: Fix reversed condition in ti_thermal_expose_sensor()
MAINTAINERS: Add maintenance information for IPA
thermal: rcar_gen3_thermal: Do not shadow thcode variable
dt-bindings: thermal: Get rid of thermal.txt and replace references
thermal: core: Move initialization after core initcall
thermal: netlink: Improve the initcall ordering
net: genetlink: Move initialization to core_initcall
thermal: rcar_gen3_thermal: Add r8a774e1 support
thermal/drivers/clock_cooling: Remove clock_cooling code
...
