Commit Graph

65 Commits

Author SHA1 Message Date
Krzysztof Kozlowski
85f18eddf0 dt-bindings: thermal: qcom-tsens: Add Eliza SoC TSENS
Document the compatible for Qualcomm Eliza SoC TSENS module, fully
compatible with TSENS v2 generation (e.g. SM8650).

Acked-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260327100733.365573-2-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2026-03-27 11:25:15 +01:00
Manaf Meethalavalappu Pallikunhi
9124e0e8f3 dt-bindings: thermal: qcom-tsens: Document the SM8750 Temperature Sensor
Document the Temperature Sensor (TSENS) on the SM8750 SoC.

Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260313-sm8750_tsens-v1-1-250fcc3794a2@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2026-03-14 11:45:46 +01:00
Richard Acayan
015c4506c3 dt-bindings: thermal: tsens: add SDM670 compatible
Add the compatible for the thermal sensors on the SDM670.

Signed-off-by: Richard Acayan <mailingradian@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260310002037.1863-2-mailingradian@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2026-03-10 11:17:41 +01:00
Rob Herring (Arm)
82d7a9da6e dt-bindings: thermal: qcom-tsens: Remove invalid tab character
Commit 1ee90870ce ("dt-bindings: thermal: tsens: Add QCS8300
compatible") uses a tab character which is illegal in YAML (at the
beginning of a line).  The original patch was correct, so this got
corrupted when applied.

Fixes: 1ee90870ce ("dt-bindings: thermal: tsens: Add QCS8300 compatible")
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2025-12-03 08:30:31 -08:00
Gaurav Kohli
1ee90870ce dt-bindings: thermal: tsens: Add QCS8300 compatible
Add compatibility string for the thermal sensors on QCS8300 platform.

Signed-off-by: Gaurav Kohli <quic_gkohli@quicinc.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Reviewed-by: Akhil P Oommen <akhilpo@oss.qualcomm.com>
Link: https://patch.msgid.link/20250822042316.1762153-2-quic_gkohli@quicinc.com
2025-11-26 15:50:59 +01:00
George Moussalem
8d6f8d5c58 dt-bindings: thermal: qcom-tsens: make ipq5018 tsens standalone compatible
The tsens IP found in the IPQ5018 SoC should not use qcom,tsens-v1 as
fallback since it has no RPM and, as such, must deviate from the
standard v1 init routine as this version of tsens needs to be explicitly
reset and enabled in the driver.

So let's make qcom,ipq5018-tsens a standalone compatible in the bindings.

Fixes: 77c6d28192 ("dt-bindings: thermal: qcom-tsens: Add ipq5018 compatible")
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: George Moussalem <george.moussalem@outlook.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://patch.msgid.link/20250818-ipq5018-tsens-fix-v1-1-0f08cf09182d@outlook.com
2025-11-25 16:07:57 +01:00
Manaf Meethalavalappu Pallikunhi
e1304efc19 dt-bindings: thermal: qcom-tsens: document the Kaanapali Temperature Sensor
Document the Temperature Sensor (TSENS) on the Kaanapali Platform.

Signed-off-by: Manaf Meethalavalappu Pallikunhi <manaf.pallikunhi@oss.qualcomm.com>
Signed-off-by: Jingyi Wang <jingyi.wang@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251021-b4-knp-tsens-v2-1-7b662e2e71b4@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-11-10 13:01:40 +01:00
Manaf Meethalavalappu Pallikunhi
79428e6089 dt-bindings: thermal: qcom-tsens: Document the Glymur temperature Sensor
Document the Temperature Sensor (TSENS) on Glymur Platform.

Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Signed-off-by: Pankaj Patil <pankaj.patil@oss.qualcomm.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250920123631.281153-1-pankaj.patil@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-09-26 13:27:44 +02:00
Gaurav Kohli
4ae50c82a5 dt-bindings: thermal: tsens: Add QCS615 compatible
Add compatibility string for the thermal sensors on QCS615 platform.

Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Gaurav Kohli <quic_gkohli@quicinc.com>
Link: https://lore.kernel.org/r/20250624064945.764245-2-quic_gkohli@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-09-25 22:10:59 +02:00
Luca Weiss
47f4bef6e7 dt-bindings: thermal: qcom-tsens: document the Milos Temperature Sensor
Document the Temperature Sensor (TSENS) on the Milos SoC.

Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250713-sm7635-fp6-initial-v2-8-e8f9a789505b@fairphone.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-07-17 10:45:01 +02:00
Sricharan Ramabadhran
77c6d28192 dt-bindings: thermal: qcom-tsens: Add ipq5018 compatible
IPQ5018 has tsens v1.0 block with 5 sensors of which 4 are in use
and 1 interrupt.

Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Sricharan Ramabadhran <quic_srichara@quicinc.com>
Signed-off-by: George Moussalem <george.moussalem@outlook.com>
Link: https://lore.kernel.org/r/DS7PR19MB88835BD1063C4D5451E14B0E9DCC2@DS7PR19MB8883.namprd19.prod.outlook.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-05-16 12:50:01 +02:00
Praveenkumar I
1a685e2b3f dt-bindings: thermal: tsens: Add ipq5332, ipq5424 compatible
The IPQ5332 and IPQ5424 use TSENS v2.3.3 IP with combined interrupt.
RPM is not available in these SoCs, hence adding new compatible
to have the sensor enablement and calibration function. Also add
nvmem-cell-names.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Praveenkumar I <quic_ipkumar@quicinc.com>
Signed-off-by: Manikanta Mylavarapu <quic_mmanikan@quicinc.com>
Link: https://lore.kernel.org/r/20250210120436.821684-2-quic_mmanikan@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-03-25 20:52:03 +01:00
Rayyan Ansari
fed79caaf7 dt-bindings: thermal: qcom-tsens: Document ipq6018 temperature sensor
Document the ipq6018 temperature sensor, which is used in ipq6018.dtsi
and is compatible with the ipq8074 temperature sensor.

Signed-off-by: Rayyan Ansari <rayyan.ansari@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240716133803.82907-1-rayyan.ansari@linaro.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2025-01-07 08:35:34 -06:00
Barnabás Czémán
fd9d75ef46 dt-bindings: thermal: tsens: Add MSM8937
Document the compatible string for tsens v1.4 block found in MSM8937.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org>
Link: https://lore.kernel.org/r/20241113-msm8917-v6-4-c348fb599fef@mainlining.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-11-13 16:21:18 +01:00
Dmitry Baryshkov
59e127d58c dt-bindings: thermal: qcom-tsens: Add SAR2130P compatible
Document compatible for thermal sensors on Qualcomm SAR2130P platform.

Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20241027-sar2130p-tsens-v1-1-8dee27fc02ae@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-11-13 16:17:57 +01:00
Linus Torvalds
2a17bb8c20 Merge tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
 "DT Bindings:

   - Drop duplicate devices in trivial-devices.yaml

   - Add a common serial peripheral device schema and reference it in
     serial device schemas.

   - Convert nxp,lpc1850-wdt, zii,rave-wdt, ti,davinci-wdt,
     snps,archs-pct, fsl,bcsr, fsl,fpga-qixis-i2c, fsl,fpga-qixis,
     fsl,cpm-enet, fsl,cpm-mdio, fsl,ucc-hdlc, maxim,ds26522,
     aspeed,ast2400-cvic, aspeed,ast2400-vic, fsl,ftm-timer,
     ti,davinci-timer, fsl,rcpm, and qcom,ebi2 to DT schema

   - Add support for rockchip,rk3576-wdt, qcom,apss-wdt-sa8255p,
     fsl,imx8qm-irqsteer, qcom,pm6150-vib, qcom,sa8255p-pdc,
     isil,isl69260, ti,tps546d24, and lpc32xx DMA mux

   - Drop duplicate nvidia,tegra186-ccplex-cluster.yaml and
     mediatek,mt6795-sys-clock.yaml

   - Add arm,gic ESPI and EPPI interrupt type specifiers

   - Add another batch of legacy compatible strings which we have no
     intention of documenting

   - Add dmas/dma-names properties to FSL lcdif

   - Fix wakeup-source reference to m8921-keypad.yaml

   - Treewide fixes of typos in bindings

  DT Core:

   - Update dtc/libfdt to upstream version v1.7.0-95-gbcd02b523429

   - More conversions to scoped iterators and __free() initializer

   - Handle overflows in address resources on 32-bit systems

   - Extend extracting compatible strings in sources from function
     parameters

   - Use of_property_present() in DT unittest

   - Clean-up of_irq_to_resource() to use helpers

   - Support #msi-cells=<0> in of_msi_get_domain()

   - Improve the kerneldoc for of_property_match_string()

   - kselftest: Ignore nodes that have ancestors disabled"

* tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (59 commits)
  dt-bindings: watchdog: Add rockchip,rk3576-wdt compatible
  dt-bindings: cpu: Drop duplicate nvidia,tegra186-ccplex-cluster.yaml
  dt-bindings: clock: mediatek: Drop duplicate mediatek,mt6795-sys-clock.yaml
  of/irq: Use helper to define resources
  of/irq: Make use of irq_get_trigger_type()
  dt-bindings: clk: vc5: Make SD/OE pin configuration properties not required
  drivers/of: Improve documentation for match_string
  of: property: Do some clean up with use of __free()
  dt-bindings: watchdog: qcom-wdt: document support on SA8255p
  dt-bindings: interrupt-controller: fsl,irqsteer: Document fsl,imx8qm-irqsteer
  dt-bindings: interrupt-controller: arm,gic: add ESPI and EPPI specifiers
  dt-bindings: dma: Add lpc32xx DMA mux binding
  dt-bindings: trivial-devices: Drop duplicate "maxim,max1237"
  dt-bindings: trivial-devices: Drop duplicate LM75 compatible devices
  dt-bindings: trivial-devices: Deprecate "ad,ad7414"
  dt-bindings: trivial-devices: Drop incorrect and duplicate at24 compatibles
  dt-bindings: wakeup-source: update reference to m8921-keypad.yaml
  dt-bindings: interrupt-controller: qcom-pdc: document support for SA8255p
  dt-bindings: Fix various typos
  of: address: Unify resource bounds overflow checking
  ...
2024-09-19 08:38:51 +02:00
Yu-Chun Lin
a7fcc23274 dt-bindings: Fix various typos
Corrected several typos in Documentation/devicetree/bindings files.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Kuan-Wei Chiu <visitorckw@gmail.com>
Reviewed-by: Matti Vaittinen <mazziesaccount@gmail.com>
Signed-off-by: Yu-Chun Lin <eleanor15x@gmail.com>
Link: https://lore.kernel.org/r/20240905151943.2792056-1-eleanor15x@gmail.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2024-09-13 14:01:34 -05:00
Nikunj Kela
f41e6475ff dt-bindings: thermal: tsens: document support on SA8255p
Add compatible for sensors representing support on SA8255p.

Signed-off-by: Nikunj Kela <quic_nkela@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240828203721.2751904-14-quic_nkela@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-09-02 13:12:54 +02:00
Krzysztof Kozlowski
f062dc5cca dt-bindings: thermal: cleanup examples indentation
Preferred indentation for DTS examples in the bindings is 4-space.  It
is also preferred not to have redundant/unused labels. No functional
change

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-22-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
80c3fda5de dt-bindings: thermal: qcom-tsens: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-11-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Abel Vesa
b18ce693a2 dt-bindings: thermal: qcom-tsens: Document the X1E80100 Temperature Sensor
Document the Temperature Sensor (TSENS) on the X1E80100 Platform.

Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Abel Vesa <abel.vesa@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20240628-x1e80100-bindings-thermal-qcom-tsens-v2-1-4843d4c2ba24@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Neil Armstrong
748b49c7df dt-bindings: thermal: qcom-tsens: document the SM8650 Temperature Sensor
Document the Temperature Sensor (TSENS) on the SM8650 Platform.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231128-topic-sm8650-upstream-bindings-tsens-v3-1-54179e6646d3@linaro.org
2024-01-02 09:33:18 +01:00
Priyansh Jain
50ab530953 dt-bindings: thermal: tsens: Add sa8775p compatible
Add compatibility string for the thermal sensors on sa8775p platform.

Signed-off-by: Priyansh Jain <quic_priyjain@quicinc.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230926085948.23046-2-quic_priyjain@quicinc.com
2023-10-15 23:40:10 +02:00
Stephan Gerhold
ba3bcfebea dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible
MSM8909 uses the TSENS v0.1 block similar to other SoCs like MDM9607.
Document the "qcom,msm8909-tsens" compatible in the existing schema.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-5-5eb632235ba7@kernkonzept.com
2023-06-26 12:03:13 +02:00
Stephan Gerhold
a06027820d dt-bindings: thermal: qcom-tsens: Drop redundant compatibles
Since the SoC compatibles must be followed by the IP version compatible
(e.g. compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1";) it is
redundant to list all the SoC compatibles again in the if statement.
It will already match the IP-version compatible.

The list has already become inconsistent since for example
"qcom,msm8939-tsens" is covered by the if statement but is not listed
there explicitly like the other SoCs.

Simplify this by dropping the redundant SoC compatibles. ipq8064 and
msm8960 are still needed because they do not have an IP-version
compatible.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-4-5eb632235ba7@kernkonzept.com
2023-06-26 12:03:13 +02:00
Praveenkumar I
074ccf8d6c dt-bindings: thermal: tsens: Add ipq9574 compatible
Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Praveenkumar I <quic_ipkumar@quicinc.com>
Signed-off-by: Varadarajan Narayanan <quic_varada@quicinc.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ec9799504fe5a141e107bb78955d8d427f00553f.1686125196.git.quic_varada@quicinc.com
2023-06-26 12:03:13 +02:00
Matti Lehtimäki
065ab3abf9 dt-bindings: thermal: tsens: Add compatible for MSM8226
Qualcomm MSM8226 has tsens v0.1 block.

Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Luca Weiss <luca@z3ntu.xyz>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230507201225.89694-3-matti.lehtimaki@gmail.com
2023-06-26 12:03:13 +02:00
Konrad Dybcio
0849027b09 dt-bindings: thermal: tsens: Add compatible for SM6375
The Qualcomm SM6375 platform has two instances of the tsens v2.8.0 block,
add a compatible for these instances.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516-topic-lost_tsens_bindings-v1-2-99715746ddb1@linaro.org
2023-06-26 12:03:13 +02:00
Konrad Dybcio
05570560d2 dt-bindings: thermal: tsens: Add QCM2290
Add the TSENS v2.x controller found on QCM2290.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516-topic-lost_tsens_bindings-v1-1-99715746ddb1@linaro.org
2023-06-26 12:03:13 +02:00
Krzysztof Kozlowski
2afa82d1fc dt-bindings: thermal: qcom-tsens: Correct unit address
Match unit-address to first reg entry.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230420072429.36255-1-krzysztof.kozlowski@linaro.org
2023-04-26 10:38:35 +02:00
Dmitry Baryshkov
acd31b9f22 dt-bindings: thermal: tsens: add per-sensor cells for msm8974
The msm8974 platform uses two sets of calibration data, add a special
case to handle both of them.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-4-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16 11:22:30 +01:00
Dmitry Baryshkov
4f4292bf12 dt-bindings: thermal: tsens: support per-sensor calibration cells
Allow specifying the exact calibration mode and calibration data as nvmem
cells, rather than specifying just a single calibration data blob.

Note, unlike the vendor kernel the calibration data uses hw_ids rather
than software sensor indices (to match actual tsens usage in
thermal zones).

Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-3-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16 11:22:30 +01:00
Dmitry Baryshkov
8c14214560 dt-bindings: thermal: tsens: add msm8956 compat
When adding support for msm8976 it was thought that msm8956 would reuse
the same compat. However checking the vendor kernel revealed that these
two platforms use different slope values for calculating the calibration
data.

Add new compatible for the tsens on msm8956 SoC.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-16 11:22:30 +01:00
Linus Torvalds
601c1aa855 Merge tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
 "These are updates of assorted thermal drivers, mostly for ARM
  platforms, generally isolated and fairly straightforward, and the
  recent Intel HFI driver fix for systems without HFI support.

  Specifics:

   - Avoid clearing the HFI status bit on systems without HFI support
     which triggers unchecked MSR access errors (Srinivas Pandruvada)

   - Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
     Weiss, Neil Armstrong)

   - Use devm_platform_get_and_ioremap_resource on the ST platform to
     group two calls into a single one (Minghao Chi)

   - Use GENMASK instead of bitmaps and validate the temperature after
     reading it in the imx8mm_thermal driver (Marcus Folkesson)

   - Convert generic-adc-thermal to DT schema (Rob Herring)

   - Fix debug print message with inverted logic in the k3_j72xx_bandgap
     driver (Keerthy)

   - Fix memory leak on thermal_of_zone_register() failure (Ido
     Schimmel)

   - Add support for IPQ8074 in the tsens thermal driver along with the
     DT bindings (Robert Marko)

   - Fix and rework the debugfs code in the tsens driver (Christian
     Marangi)

   - Add calibration and DT documentation for the imx8mm driver (Marek
     Vasut)

   - Add DT bindings and compatible for the Mediatek SoCs mt7981 and
     mt7983 (Daniel Golle)

   - Don't show an error message if it happens at probe time while it
     will be deferred on the QCom SPMI ADC driver (Johan Hovold)

   - Add HWMon support for the imx8mm board (Alexander Stein)

   - Remove pointless include from the power allocator governor
     (Christophe JAILLET)

   - Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
     (Krzysztof Kozlowski)

   - Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)

   - Demote error log of thermal zone register to debug in the tsens
     QCom driver (Manivannan Sadhasivam)

   - Consolidate the the efuse values and the errata handling in the TI
     Bandgap driver (Bryan Brattlof)

   - Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
     bindings (Lad Prabhakar)

   - Fix the irq handler return value in the LMh driver (Bjorn
     Andersson)

   - Delete empty platform remove callback from imx_sc_thermal (Uwe
     Kleine-König)"

* tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits)
  thermal/drivers/imx_sc_thermal: Drop empty platform remove function
  thermal/drivers/qcom/lmh: Fix irq handler return value
  dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
  thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
  dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
  dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
  dt-bindings: thermal: k3-j72xx: elaborate on binding description
  thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
  thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
  thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
  thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
  thermal/drivers/qcom: Demote error log of thermal zone register to debug
  thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
  dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
  thermal/core/power allocator: Remove a useless include
  thermal/drivers/imx8mm: Add hwmon support
  thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
  dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
  thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
  thermal/drivers/imx: Add support for loading calibration data from OCOTP
  ...
2022-12-15 10:16:04 -08:00
Neil Armstrong
4a9f20112c dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
The Qualcomm SM8550 platform has three instances of the tsens block,
add a compatible for these instances.

Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20221114-narmstrong-sm8550-upstream-tsens-v1-0-0e169822830f@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:41 +01:00
Krzysztof Kozlowski
fa17c4136d dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
Narrow number of interrupts per variants: SC8280XP, SM6350 and SM8450.
The compatibles are already used and described.  They only missed the
constraints of number of interrupts.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221116113140.69587-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:40 +01:00
Robert Marko
c6db32ec7c dt-bindings: thermal: tsens: Add ipq8074 compatible
Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it
only uses one IRQ, so tsens v2 compatible cannot be used as the fallback.

We also have to make sure that correct interrupts are set according to
compatibles, so populate interrupt information per compatibles.

Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-1-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14 15:25:40 +01:00
Luca Weiss
f0f4c3adcf dt-bindings: thermal: tsens: Add sm8450 compatible
Document the tsens-v2 compatible for sm8450 SoC.

Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221016090035.565350-5-luca@z3ntu.xyz
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14 15:25:39 +01:00
Adam Skladowski
47612a9fc4 dt-bindings: thermal: tsens: Add SM6115 compatible
Document compatible for tsens on Qualcomm SM6115 platform
according to downstream dts it ship v2.4 of IP

Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221130200950.144618-3-a39.skl@gmail.com
Signed-off-by: Rob Herring <robh@kernel.org>
2022-12-06 14:50:36 -06:00
Linus Torvalds
86c87bea6b Merge tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
 "Bindings:

   - Convert smsc,lan91c111, qcom,spi-qup, qcom,msm-uartdm,
     qcom,i2c-qup, qcom,gsbi, i2c-mt65xx, TI wkup_m3_ipc (and new
     props), qcom,smp2p, TI timer, Mediatek gnss, Mediatek topckgen,
     Mediatek apmixedsys, Mediatek infracfg, fsl,ls-extirq,
     fsl,layerscape-dcfg, QCom PMIC SPMI, rda,8810pl-timer, Xilinx
     zynqmp_ipi, uniphier-pcie, and Ilitek touchscreen controllers

   - Convert various Arm Ltd peripheral IP bindings to schemas

   - New bindings for Menlo board CPLD, DH electronics board CPLD,
     Qualcomm Geni based QUP I2C, Renesas RZ/G2UL OSTM, Broafcom BCM4751
     GNSS, MT6360 PMIC, ASIX USB Ethernet controllers, and
     Microchip/SMSC LAN95xx USB Ethernet controllers

   - Add vendor prefix for Enclustra

   - Add various compatible string additions

   - Various example fixes and cleanups

   - Remove unused hisilicon,hi6220-reset binding

   - Treewide fix properties missing type definition

   - Drop some empty and unreferenced .txt bindings

   - Documentation improvements for writing schemas

  DT driver core:

   - Drop static IRQ resources for DT platform devices as IRQ setup is
     dynamic and drivers have all been converted to use
     platform_get_irq() and friends

   - Rework memory allocations and frees for overlays

   - Continue overlay notifier callbacks on successful calls and add
     unittests

   - Handle 'interrupts-extended' in early DT IRQ setup

   - Fix of_property_read_string() errors to match documentation

   - Ignore disabled nodes in FDT API calls"

* tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (86 commits)
  of/irq: fix typo in comment
  dt-bindings: Fix properties without any type
  Revert "dt-bindings: mailbox: qcom-ipcc: add missing properties into example"
  dt-bindings: input: touchscreen: ilitek_ts_i2c: Absorb ili2xxx bindings
  dt-bindings: timer: samsung,exynos4210-mct: define strict clock order
  dt-bindings: timer: samsung,exynos4210-mct: drop unneeded minItems
  dt-bindings: timer: cdns,ttc: drop unneeded minItems
  dt-bindings: mailbox: zynqmp_ipi: convert to yaml
  dt-bindings: usb: ci-hdrc-usb2: fix node node for ethernet controller
  dt-bindings: net: add schema for Microchip/SMSC LAN95xx USB Ethernet controllers
  dt-bindings: net: add schema for ASIX USB Ethernet controllers
  of/fdt: Ignore disabled memory nodes
  dt-bindings: arm: fix typos in compatible
  dt-bindings: mfd: Add bindings child nodes for the Mediatek MT6360
  dt-bindings: display: convert Arm Komeda to DT schema
  dt-bindings: display: convert Arm Mali-DP to DT schema
  dt-bindings: display: convert Arm HDLCD to DT schema
  dt-bindings: display: convert PL110/PL111 to DT schema
  dt-bindings: arm: convert vexpress-config to DT schema
  dt-bindings: arm: convert vexpress-sysregs to DT schema
  ...
2022-05-25 14:56:06 -07:00
Bjorn Andersson
30988d3b31 dt-bindings: thermal: tsens: Add sc8280xp compatible
The Qualcomm SC8280XP platform has three instances of the tsens block,
add a compatible for these instances.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220503153436.960184-1-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:52 +02:00
Dmitry Baryshkov
a63fa2b601 dt-bindings: thermal: qcom-tsens.yaml: add msm8960 compat string
Add compatibility string for the thermal sensors on MSM8960/APQ8064
platforms.

Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220406002648.393486-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:51 +02:00
Luca Weiss
0bd1767942 dt-bindings: thermal: tsens: Add SM6350 compatible
Add devicetree compatible for tsens on SM6350 SoC.

Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211213082614.22651-6-luca.weiss@fairphone.com
2022-04-08 09:24:07 -05:00
Luca Weiss
e8ec6bb302 dt-bindings: thermal: tsens: Add msm8953 compatible
Document the compatible string for tsens found in msm8953.

Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220220201909.445468-3-luca@z3ntu.xyz
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-03-08 21:26:09 +01:00
Konrad Dybcio
7c54b82b45 arm64: dts: qcom: sdm630: Add TSENS node
This will enable temperature reporting for various SoC
components.

Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@somainline.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Link: https://lore.kernel.org/r/20210728222542.54269-15-konrad.dybcio@somainline.org
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
2021-08-04 15:07:03 -05:00
Linus Torvalds
f7ea4be434 Merge tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:

 - Add rk3568 sensor support (Finley Xiao)

 - Add missing MODULE_DEVICE_TABLE for the Spreadtrum sensor (Chunyan
   Zhang)

 - Export additionnal attributes for the int340x thermal processor
   (Srinivas Pandruvada)

 - Add SC7280 compatible for the tsens driver (Rajeshwari Ravindra
   Kamble)

 - Fix kernel documentation for thermal_zone_device_unregister() and use
   devm_platform_get_and_ioremap_resource() (Yang Yingliang)

 - Fix coefficient calculations for the rcar_gen3 sensor driver (Niklas
   Söderlund)

 - Fix shadowing variable rcar_gen3_ths_tj_1 (Geert Uytterhoeven)

 - Add missing of_node_put() for the iMX and Spreadtrum sensors
   (Krzysztof Kozlowski)

 - Add tegra3 thermal sensor DT bindings (Dmitry Osipenko)

 - Stop the thermal zone monitoring when unregistering it to prevent a
   temperature update without the 'get_temp' callback (Dmitry Osipenko)

 - Add rk3568 DT bindings, convert bindings to yaml schemas and add the
   corresponding compatible in the Rockchip sensor (Ezequiel Garcia)

 - Add the sc8180x compatible for the Qualcomm tsensor (Bjorn Andersson)

 - Use the find_first_zero_bit() function instead of custom code (Andy
   Shevchenko)

 - Fix the kernel doc for the device cooling device (Yang Li)

 - Reorg the processor thermal int340x to set the scene for the PCI mmio
   driver (Srinivas Pandruvada)

 - Add PCI MMIO driver for the int340x processor thermal driver
   (Srinivas Pandruvada)

 - Add hwmon sensors for the mediatek sensor (Frank Wunderlich)

 - Fix warning for return value reported by Smatch for the int340x
   thermal processor (Srinivas Pandruvada)

 - Fix wrong register access and decoding for the int340x thermal
   processor (Srinivas Pandruvada)

* tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (23 commits)
  thermal/drivers/int340x/processor_thermal: Fix tcc setting
  thermal/drivers/int340x/processor_thermal: Fix warning for return value
  thermal/drivers/mediatek: Add sensors-support
  thermal/drivers/int340x/processor_thermal: Add PCI MMIO based thermal driver
  thermal/drivers/int340x/processor_thermal: Split enumeration and processing part
  thermal: devfreq_cooling: Fix kernel-doc
  thermal/drivers/intel/intel_soc_dts_iosf: Switch to use find_first_zero_bit()
  dt-bindings: thermal: tsens: Add sc8180x compatible
  dt-bindings: rockchip-thermal: Support the RK3568 SoC compatible
  dt-bindings: thermal: convert rockchip-thermal to json-schema
  thermal/core/thermal_of: Stop zone device before unregistering it
  dt-bindings: thermal: Add binding for Tegra30 thermal sensor
  thermal/drivers/sprd: Add missing of_node_put for loop iteration
  thermal/drivers/imx_sc: Add missing of_node_put for loop iteration
  thermal/drivers/rcar_gen3_thermal: Do not shadow rcar_gen3_ths_tj_1
  thermal/drivers/rcar_gen3_thermal: Fix coefficient calculations
  thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
  thermal/core: Correct function name thermal_zone_device_unregister()
  dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280
  thermal/drivers/int340x: processor_thermal: Export additional attributes
  ...
2021-07-10 11:43:25 -07:00
Bjorn Andersson
481bd29729 dt-bindings: thermal: tsens: Add sc8180x compatible
The Qualcomm sc8180x platform has the usual tsens blocks, add compatible
for this.

Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210608201638.2136344-1-bjorn.andersson@linaro.org
2021-07-04 18:28:04 +02:00
Rob Herring
972d6a7dce dt-bindings: Drop redundant minItems/maxItems
If a property has an 'items' list, then a 'minItems' or 'maxItems' with the
same size as the list is redundant and can be dropped. Note that is DT
schema specific behavior and not standard json-schema behavior. The tooling
will fixup the final schema adding any unspecified minItems/maxItems.

This condition is partially checked with the meta-schema already, but
only if both 'minItems' and 'maxItems' are equal to the 'items' length.
An improved meta-schema is pending.

Cc: Jens Axboe <axboe@kernel.dk>
Cc: Stephen Boyd <sboyd@kernel.org>
Cc: Herbert Xu <herbert@gondor.apana.org.au>
Cc: "David S. Miller" <davem@davemloft.net>
Cc: David Airlie <airlied@linux.ie>
Cc: Daniel Vetter <daniel@ffwll.ch>
Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com>
Cc: Kamal Dasu <kdasu.kdev@gmail.com>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Thomas Gleixner <tglx@linutronix.de>
Cc: Marc Zyngier <maz@kernel.org>
Cc: Joerg Roedel <joro@8bytes.org>
Cc: Mauro Carvalho Chehab <mchehab@kernel.org>
Cc: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Cc: Jakub Kicinski <kuba@kernel.org>
Cc: Wolfgang Grandegger <wg@grandegger.com>
Cc: Andrew Lunn <andrew@lunn.ch>
Cc: Vivien Didelot <vivien.didelot@gmail.com>
Cc: Vladimir Oltean <olteanv@gmail.com>
Cc: Bjorn Helgaas <bhelgaas@google.com>
Cc: Kishon Vijay Abraham I <kishon@ti.com>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: "Uwe Kleine-König" <u.kleine-koenig@pengutronix.de>
Cc: Lee Jones <lee.jones@linaro.org>
Cc: Ohad Ben-Cohen <ohad@wizery.com>
Cc: Mathieu Poirier <mathieu.poirier@linaro.org>
Cc: Paul Walmsley <paul.walmsley@sifive.com>
Cc: Palmer Dabbelt <palmer@dabbelt.com>
Cc: Albert Ou <aou@eecs.berkeley.edu>
Cc: Alessandro Zummo <a.zummo@towertech.it>
Cc: Alexandre Belloni <alexandre.belloni@bootlin.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Wim Van Sebroeck <wim@linux-watchdog.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # for MMC
Acked-by: Jassi Brar <jassisinghbrar@gmail.com>
Acked-By: Vinod Koul <vkoul@kernel.org>
Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Reviewed-by: Arnaud Pouliquen <arnaud.pouliquen@st.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Philipp Zabel <p.zabel@pengutronix.de>
Acked-by: Wolfram Sang <wsa@kernel.org> # for I2C
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Link: https://lore.kernel.org/r/20210615191543.1043414-1-robh@kernel.org
2021-06-21 13:56:46 -06:00
Rajeshwari Ravindra Kamble
c6e66f5c21 dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280
Adding compatible string in TSENS dt-bindings for SC7280.

Signed-off-by: Rajeshwari Ravindra Kamble <rkambl@codeaurora.org>
Reviewed-by: Matthias Kaehlcke <mka@chromium.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1620367641-23383-2-git-send-email-rkambl@codeaurora.org
2021-06-12 21:07:23 +02:00
Ansuel Smith
26b2f03d2a dt-bindings: thermal: tsens: Document ipq8064 bindings
Document the use of bindings used for msm8960 tsens based devices.
msm8960 use the same gcc regs and is set as a child of the qcom gcc.

Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-10-ansuelsmth@gmail.com
2021-04-22 14:10:24 +02:00