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Pull device tree changes from Grant Likely: "All around device tree changes destined for v3.8. Aside from the documentation updates the highlights in this branch include: - Kbuild changes for using CPP with .dts files - locking fix from preempt_rt patchset - include DT alias names in device uevent - Selftest bugfixes and improvements - New function for counting phandles stanzas in a property - constify argument to of_node_full_name() - Various bug fixes This tree did also contain a commit to use platform_device_add instead of open-coding the device add code, but it caused problems with amba devices and needed to be reverted." * tag 'dt-for-linus' of git://git.secretlab.ca/git/linux: (23 commits) Revert "of: use platform_device_add" kbuild: limit dtc+cpp include path gpio: Make of_count_named_gpios() use new of_count_phandle_with_args() of: Create function for counting number of phandles in a property of/base: Clean up exit paths for of_parse_phandle_with_args() of/selftest: Use selftest() macro throughout of/selftest: Fix GPIOs selftest to cover the 7th case of: fix recursive locking in of_get_next_available_child() documentation/devicetree: Fix a typo in exynos-dw-mshc.txt OF: convert devtree lock from rw_lock to raw spinlock of/exynos_g2d: Add Bindings for exynos G2D driver kbuild: create a rule to run the pre-processor on *.dts files input: Extend matrix-keypad device tree binding devicetree: Move NS2 LEDs binding into LEDs directory of: use platform_device_add powerpc/5200: Fix size to request_mem_region() call documentation/devicetree: Fix typos of: add 'const' to of_node_full_name parameter of: Output devicetree alias names in uevent DT: add vendor prefixes for Renesas and Toshiba ...
64 lines
1.9 KiB
Plaintext
64 lines
1.9 KiB
Plaintext
Device tree binding vendor prefix registry. Keep list in alphabetical order.
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This isn't an exhaustive list, but you should add new prefixes to it before
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using them to avoid name-space collisions.
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ad Avionic Design GmbH
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adi Analog Devices, Inc.
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ak Asahi Kasei Corp.
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amcc Applied Micro Circuits Corporation (APM, formally AMCC)
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apm Applied Micro Circuits Corporation (APM)
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arm ARM Ltd.
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atmel Atmel Corporation
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bosch Bosch Sensortec GmbH
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brcm Broadcom Corporation
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cavium Cavium, Inc.
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chrp Common Hardware Reference Platform
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cirrus Cirrus Logic, Inc.
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cortina Cortina Systems, Inc.
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dallas Maxim Integrated Products (formerly Dallas Semiconductor)
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denx Denx Software Engineering
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emmicro EM Microelectronic
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epson Seiko Epson Corp.
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est ESTeem Wireless Modems
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fsl Freescale Semiconductor
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GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
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gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
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hp Hewlett Packard
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ibm International Business Machines (IBM)
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idt Integrated Device Technologies, Inc.
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img Imagination Technologies Ltd.
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intercontrol Inter Control Group
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linux Linux-specific binding
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marvell Marvell Technology Group Ltd.
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maxim Maxim Integrated Products
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mosaixtech Mosaix Technologies, Inc.
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national National Semiconductor
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nintendo Nintendo
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nvidia NVIDIA
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nxp NXP Semiconductors
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onnn ON Semiconductor Corp.
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picochip Picochip Ltd
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powervr PowerVR (deprecated, use img)
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qcom Qualcomm, Inc.
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ramtron Ramtron International
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realtek Realtek Semiconductor Corp.
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renesas Renesas Electronics Corporation
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samsung Samsung Semiconductor
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sbs Smart Battery System
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schindler Schindler
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sil Silicon Image
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simtek
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sirf SiRF Technology, Inc.
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snps Synopsys, Inc.
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st STMicroelectronics
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ste ST-Ericsson
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stericsson ST-Ericsson
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ti Texas Instruments
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toshiba Toshiba Corporation
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via VIA Technologies, Inc.
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wlf Wolfson Microelectronics
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wm Wondermedia Technologies, Inc.
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winbond Winbond Electronics corp.
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xlnx Xilinx
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